Orthogonal Magnetic Sensor Assembly for Medical Tracking
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Solution Overview
Problem
Existing tracking systems for medical devices within medical procedures face challenges in efficiently determining the location and orientation of these devices using magnetic fields, particularly in reducing the size of position and orientation sensor packages while maintaining accuracy.
Innovation Solution
A sensor assembly is developed, comprising a multilayer circuit with a first magnetic field sensor aligned along a longitudinal axis and a second magnetic field sensor oriented orthogonally to the longitudinal axis, integrated within a housing that optimizes the arrangement of electrical pads and leads for efficient tracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple magnetic field sensors are integrated into a compact sensor package, then the tracking precision and six degrees of freedom capability are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple magnetic field sensors (first and second magnetic field sensors with orthogonal sensing directions) onto a single multilayer circuit substrate. The sensors are integrated with their respective circuitry on the same flexible substrate, merging what would traditionally be separate components into one unified sensor package, thereby achieving six degrees of freedom tracking capability while managing device complexity
Solution Approach 2:
The patent utilizes a multilayer circuit structure where electrical pads are positioned on both sides of the flexible substrate. This three-dimensional arrangement allows sensors and circuitry to be distributed across multiple layers and sides of the substrate, enabling compact integration of multiple sensors with orthogonal orientations without excessive planar complexity
2Volume of moving object
If the sensor package size is reduced for minimally invasive medical procedures, then the ease of operation and patient safety are improved, but the manufacturing precision and assembly difficulty increase
Solution Approach 1:
The patent employs a flexible substrate as the base for the multilayer circuit, allowing the sensor package to be made compact and adaptable to minimally invasive medical device constraints. The flexible nature enables the sensor package to be miniaturized while maintaining structural integrity and electrical connections, facilitating reduced sensor package size for clinical applications
Solution Approach 2:
The patent integrates multiple functional components (sensors, circuitry, electrical connections) into a nested multilayer structure where components are arranged in three-dimensional space on opposite sides of the flexible substrate. This nesting approach allows compact packaging of multiple sensors and their associated circuitry within a small volume, achieving miniaturization while managing manufacturing precision requirements
3Device complexity
If electrical pads are positioned on both sides of the flexible substrate for compact integration, then the device complexity is reduced, but the manufacturing process complexity increases
Solution Approach 1:
The patent divides the electrical connections into two segments: electrical pads on the first side of the flexible substrate connect to the first magnetic field sensor, while electrical pads on the opposite second side connect to the second magnetic field sensor. This segmentation allows each sensor to be independently connected to its corresponding pads on the appropriate side of the substrate, simplifying the overall circuit integration despite the bidirectional pad arrangement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise tracking of medical devices in six degrees of freedom, while minimizing the size and complexity of the sensor package, thus enhancing the accuracy and usability of medical device tracking systems.
Implementation Method 1
The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis
Implementation Method 2
The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.