Orthogonal Substrate Arrangement for Photonic-Electronic Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current integration and packaging technologies for photonic and electronic components face challenges in efficiently distributing optical and electrical signals, particularly in achieving robust and efficient interconnects between components.
Innovation Solution
The arrangement of three substantially planar substrates, where one substrate with photonic devices is orthogonal to the other two, allowing for edge-coupled optical waveguide circuits and electrical connections through an L-shaped junction, enabling effective communication of light and electrical signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional integration and packaging technologies are used to combine photonic and electronic components, then components can be assembled, but signal distribution efficiency and interconnect robustness deteriorate
Solution Approach 1:
The patent transitions from planar 2D substrate layouts to a 3D orthogonal configuration where photonic and electronic substrates are positioned at right angles to each other. This dimensional change enables direct vertical coupling between photonic devices on one substrate and electronic components on another, eliminating the need for complex lateral signal routing and improving both interconnect robustness and signal distribution efficiency.
Solution Approach 2:
The patent introduces an intermediary coupling structure that facilitates efficient signal transfer between the photonic substrate and electronic substrate. This intermediary mechanism enables direct optical and electrical interconnects across the orthogonal interface, resolving the signal distribution inefficiencies inherent in traditional planar packaging approaches.
2Stability of the object's composition
If photonic devices are integrated with electronic components using conventional methods, then assembly is achieved, but mechanical stability and impedance continuity worsen
Solution Approach 1:
By positioning photonic and electronic substrates in orthogonal 3D space rather than adjacent 2D planes, the patent creates inherently more stable mechanical connections with better alignment tolerance. The vertical stacking configuration reduces mechanical stress and improves structural rigidity while maintaining impedance continuity through direct coupling interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides a mechanically robust and efficient means for signal distribution, facilitating the operation of optoelectronic devices such as optical transmitters and receivers with reduced impedance discontinuity and improved mechanical stability.
Implementation Method 1
the optical waveguide circuit is able to communicate light with the one or more photonic devices via the optical interface
Implementation Method 2
some of the second electrical transmission lines are able to communicate electrical signals with some of the first electrical transmission lines
Data Source
AI summary
An optoelectronic device having three substantially planar substrates arranged such that one of the substrates is orthogonal to the other two substrates. In an example embodiment, the first substrate may have one or more photonic devices configured to emit or receive light traveling substantially orthogonally with respect to a major plane of the first substrate. The second substrate has an optical waveguide circuit thereon that is edge-coupled to receive (or transmit) the light from (to) the one or more photonic devices. The third substrate has an electrical circuit thereon and is connected to form an L-shaped junction with the first substrate, the L-shaped junction providing electrical connections between the corresponding electrical transmission lines located on the first and third substrates, e.g., to communicate electrical signals with the one or more photonic devices. In some embodiments, the optoelectronic device can be used to implement an optical transmitter or receiver.