Oscillation Circuit Temperature Correction With On-Chip Heater
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Solution Overview
Problem
Existing semiconductor devices require costly and time-consuming methods, such as thermostatic baths or thermostreamers, to evaluate frequency temperature characteristics of oscillation signals after package assembly, making it difficult to efficiently create temperature correction data.
Innovation Solution
A semiconductor integrated circuit with an oscillation circuit, a built-in heater, and a temperature sensor that uses temperature correction data stored in nonvolatile memory to control the frequency of the oscillation signal, allowing for efficient evaluation of frequency temperature characteristics without external devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external devices such as thermostatic baths or thermostreamers are used to measure frequency temperature characteristics, then measurement accuracy is improved, but device complexity and cost increase
Solution Approach 1:
The semiconductor device performs self-measurement of frequency temperature characteristics using its own internal resources (oscillation circuit, temperature sensor, and frequency measurement circuit) without requiring external measurement equipment. The device measures its own oscillation frequency at different temperatures, eliminating the need for complex external apparatus.
Solution Approach 2:
The semiconductor device integrates multiple functions into a single chip: oscillation signal generation, temperature sensing, frequency measurement, and data storage. This multi-functional integration allows the device to perform both its primary function and self-characterization without requiring separate external instruments.
2Reliability
If external measurement devices are used to evaluate frequency temperature characteristics, then measurement reliability is improved, but time consumption increases
Solution Approach 1:
The device performs self-evaluation of its frequency temperature characteristics using internal circuits, eliminating the time-consuming process of external measurement setup and execution. The oscillation circuit, temperature sensor, and frequency measurement circuit work together to automatically characterize the device's temperature-dependent frequency behavior.
Solution Approach 2:
The device pre-stores frequency temperature characteristics data in nonvolatile memory during manufacturing or initialization. This preliminary characterization allows for quick reference and adjustment without requiring time-consuming real-time measurements during operation or testing.
3Measurement precision
If external devices are used to create temperature correction data, then data accuracy is improved, but manufacturing cost increases
Solution Approach 1:
The semiconductor device creates its own temperature correction data using internal resources. The frequency measurement circuit measures the oscillation frequency at different temperatures, and the microprocessor processes this data to generate correction values, eliminating the need for expensive external measurement equipment during manufacturing.
Solution Approach 2:
The device creates a digital model (temperature correction data) of its physical frequency-temperature relationship through self-measurement. This digital copy accurately represents the temperature characteristics without requiring physical external measurement apparatus, reducing manufacturing costs while maintaining accuracy.
4Ease of operation
If built-in heater and temperature sensor are used to control oscillation frequency, then ease of operation is improved, but device complexity increases
Solution Approach 1:
The semiconductor device integrates multiple functions into the oscillation circuit: oscillation signal generation, temperature sensing, heating, frequency measurement, and automatic correction. This multi-functionality allows easy frequency control through a single integrated system while managing the complexity through unified design.
Solution Approach 2:
The device implements a feedback control loop where the temperature sensor monitors the oscillation circuit temperature, the microprocessor calculates the required frequency correction based on stored characteristics, and the oscillation circuit adjusts its frequency accordingly. This automated feedback system simplifies operation while managing internal complexity through intelligent control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick and cost-effective evaluation of frequency temperature characteristics, reducing the time and cost associated with creating temperature correction data by allowing the oscillation circuit to be efficiently heated and reducing frequency deviations within the operational temperature range.
Implementation Method 1
a heater configured to heat the oscillation circuit
Implementation Method 2
a temperature sensor configured to detect a temperature of the oscillation circuit
Data Source
AI summary
Provided is a semiconductor integrated circuit including an oscillation circuit configured to output an oscillation signal, a heater configured to heat the oscillation circuit, a temperature sensor configured to detect a temperature of the oscillation circuit, and a nonvolatile memory configured to store temperature correction data. The oscillation circuit controls a frequency of the oscillation signal based on an output signal of the temperature sensor and the temperature correction data.