Oscillator Circuit Configuration for Carrier Aggregation Isolation
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Solution Overview
Problem
Simultaneously running LTE transceivers in Carrier Aggregation mode face challenges such as high cost, increased printed circuit board area, limited frequency band combinations, and cross-talk issues due to the placement of oscillators in different chips or on the same chip, which complicates non-contiguous intra-band carrier aggregation and increases the volume of the final product.
Innovation Solution
The implementation of an oscillator circuit with multiple possible configurations that can select the optimal configuration based on the frequencies of the oscillator signals to be generated, using controlled oscillator modules and frequency adjustment circuits to reduce cross-talk interferences, and a variable power supply module to adjust power to specific parts of the oscillator circuit, allowing for flexible LO generation and dynamic DCO selection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If oscillators are placed in different chips to avoid cross-talk, then cross-talk is reduced, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges multiple oscillators onto a single semiconductor chip, integrating what would traditionally be separate components. This consolidation reduces the number of chips and inter-chip connections needed, thereby reducing device complexity while maintaining cross-talk performance through careful layout and isolation techniques.
Solution Approach 2:
The patent introduces shielding structures and isolation circuits as intermediary elements between oscillators on the same chip. These intermediaries act as barriers that prevent cross-talk interference, allowing multiple oscillators to coexist on a single chip without compromising signal integrity.
2Device complexity
If oscillators are placed on the same chip to reduce cost and area, then device complexity and manufacturing cost decrease, but cross-talk increases
Solution Approach 1:
The patent introduces shielding structures and isolation circuits as intermediary elements between oscillators on the same chip. These intermediaries act as barriers that prevent cross-talk interference, allowing multiple oscillators to coexist on a single chip without compromising signal integrity.
Solution Approach 2:
The patent applies different design characteristics to different regions of the chip around each oscillator. This includes localized shielding, differential routing, and frequency planning that creates favorable electromagnetic environments for each oscillator, thereby reducing cross-talk while maintaining integration benefits.
3Adaptability or versatility
If multiple oscillators are integrated on a single chip, then the number of supported frequency band combinations increases, but cross-talk interferences occur
Solution Approach 1:
The patent employs frequency planning and tuning mechanisms that allow oscillators to operate at specific frequency ranges and relationships. By carefully selecting and adjusting oscillator frequencies, the system supports multiple frequency band combinations while avoiding frequency conflicts and cross-talk conditions.
Solution Approach 2:
The patent introduces shielding structures and isolation circuits as intermediary elements between oscillators on the same chip. These intermediaries act as barriers that prevent cross-talk interference, allowing multiple oscillators to coexist on a single chip without compromising signal integrity.
4Volume of moving object
If transceivers are integrated on a single chip, then the overall size and cost of the system decrease, but cross-talk and isolation challenges increase
Solution Approach 1:
The patent merges multiple transceiver functions onto a single semiconductor chip, consolidating what would traditionally require multiple discrete components. This integration dramatically reduces the overall volume of the final product while maintaining performance through careful architectural design.
Solution Approach 2:
The patent introduces shielding structures and isolation circuits as intermediary elements between oscillators on the same chip. These intermediaries act as barriers that prevent cross-talk interference, allowing multiple oscillators to coexist on a single chip without compromising signal integrity.
Data Source
AI summary
An apparatus for providing oscillator signals includes an oscillator circuit configured to generate a first oscillator signal with a first oscillator signal frequency for a frequency conversion of a first signal to be converted and to generate a second oscillator signal with a second oscillator signal frequency for a frequency conversion of a second signal to be converted. The oscillator circuit is configured to enable the generation of the first oscillator signal with the first oscillator signal frequency and the second oscillator signal with the second oscillator signal frequency based on at least two different possible oscillator circuit configurations. The control circuit is configured to select, based on the first oscillator signal frequency and the second oscillator signal frequency, one of the possible oscillator circuit configurations of the oscillator circuit for generating the first oscillator signal and the second oscillator signal.