Oscillator Lead Terminal Impact Absorption
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Solution Overview
Problem
Existing oscillators face challenges in stabilizing the resonance frequency due to external impacts, which cause stress on the resonator, leading to harmful effects on the oscillation characteristics.
Innovation Solution
The oscillator design includes a resonator package with a heat generator attached to the resonator and lead terminals that support the resonator via a conductive bonding material, providing a suspended connection to the board, which absorbs impacts and reduces stress on the resonator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the resonator is rigidly coupled to the board with terminals, then the electrical connection is stable, but external impacts propagate to the resonator causing stress and harmful effects on oscillation characteristics
Solution Approach 1:
The patent introduces a lead terminal as an intermediary component between the resonator and the board. This lead terminal includes a support lead section that provides mechanical support and electrical connection while being designed to absorb impact energy, thereby protecting the resonator from direct impact stress while maintaining stable electrical connection.
Solution Approach 2:
The support lead section of the lead terminal is designed with flexibility to absorb impact energy. The lead terminal can deform under external impact forces, acting as a flexible buffer that protects the rigid resonator from stress while maintaining the electrical connection to the board.
2Device complexity
If the resonator is rigidly coupled to the board, then the structure is simple, but impact propagation causes stress in the support section of the resonator element
Solution Approach 1:
The lead terminal serves as an intermediary coupling structure between the resonator and the board. It provides both mechanical support and electrical connection functions, replacing direct rigid coupling while adding impact absorption capability through its deformable support lead section.
Solution Approach 2:
The support lead section is designed beforehand to absorb impact energy before it reaches the resonator. By positioning this energy-absorbing structure in advance between the board and the resonator, the design prevents impact stress from reaching the resonator's support section.
3Temperature
If terminals are coupled to both surfaces of the board, then temperature stabilization is improved, but impact propagation path is increased
Solution Approach 1:
The lead terminal acts as an intermediary that provides thermal conduction for temperature stabilization while simultaneously serving as an impact buffer. The support lead section absorbs mechanical impact energy, breaking the direct propagation path from the board to the resonator while maintaining thermal contact for temperature control.
Solution Approach 2:
The support lead section functions as a flexible element that can deform under impact, creating a mechanical discontinuity that blocks impact propagation while maintaining sufficient thermal contact between the resonator and the board for effective temperature stabilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the impact resistance and stability of the oscillator by reducing stress on the resonator, improving its oscillation characteristics and frequency stability.
Implementation Method 1
a heat generator attached to the resonator, electrically connected to the resonator package
Implementation Method 2
a plurality of lead terminals connected to the board, and configured to support the resonator... the support lead section may include a folding-back part
Data Source
AI summary
An oscillator includes a board having a first surface, and provided with a housing section opening on the first surface, a resonator including a resonator element and a resonator package configured to house the resonator element, a heat generator attached to the resonator, electrically connected to the resonator package, and disposed inside the housing section, and a plurality of lead terminals connected to the board, and configured to support the resonator.


