Oscillation Circuit Frequency Correction Using On-Chip Heating
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Solution Overview
Problem
Existing semiconductor devices require costly and time-consuming methods, such as thermostatic baths or thermostreamers, to evaluate frequency temperature characteristics of oscillation signals after package assembly, making it difficult to efficiently create temperature correction data.
Innovation Solution
A semiconductor integrated circuit with an oscillation circuit, a built-in heater, a temperature sensor, and nonvolatile memory that controls the oscillation signal frequency based on temperature data, allowing for efficient evaluation and correction of frequency temperature characteristics without external devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external devices such as thermostatic baths or thermostreamers are used to measure frequency temperature characteristics, then measurement accuracy is improved, but device complexity and cost increase
Solution Approach 1:
The semiconductor device performs self-measurement of frequency temperature characteristics using its own internal resources. The oscillation circuit generates the oscillation signal, the temperature sensor detects the device temperature, and the control circuit correlates temperature with frequency without requiring external measurement equipment. This self-service approach eliminates the need for thermostatic baths or thermostreamers while maintaining measurement capability.
Solution Approach 2:
The patent introduces a temperature sensor as an intermediary element that enables indirect measurement of frequency temperature characteristics. Instead of using complex external thermal chambers, the temperature sensor provides real-time temperature data that the control circuit uses to evaluate frequency characteristics at different temperatures, simplifying the measurement system.
2Measurement precision
If external measurement equipment is used to evaluate frequency temperature characteristics, then measurement accuracy is improved, but time required for inspection increases
Solution Approach 1:
The device performs self-measurement of frequency temperature characteristics using its own internal resources. The oscillation circuit generates the oscillation signal, the temperature sensor detects the device temperature, and the control circuit correlates temperature with frequency without requiring external measurement equipment. This self-service approach eliminates the need for thermostatic baths or thermostreamers while maintaining measurement capability.
Solution Approach 2:
The semiconductor device measures frequency temperature characteristics at multiple temperatures during the manufacturing process before final assembly. By performing these measurements preliminarily and storing correction data in advance, the need for time-consuming post-assembly temperature characterization is eliminated, reducing overall inspection time.
3Measurement precision
If external measurement devices are used to create temperature correction data, then data accuracy is improved, but manufacturing cost increases
Solution Approach 1:
The semiconductor device performs self-measurement of frequency temperature characteristics using its own internal resources. The oscillation circuit generates the oscillation signal, the temperature sensor detects the device temperature, and the control circuit correlates temperature with frequency without requiring external measurement equipment. This self-service approach eliminates the need for thermostatic baths or thermostreamers while maintaining measurement capability.
4Reliability
If package stress effects are considered for frequency correction, then frequency stability is improved, but measurement complexity increases
Solution Approach 1:
The semiconductor device performs self-measurement of frequency temperature characteristics using its own internal resources. The oscillation circuit generates the oscillation signal, the temperature sensor detects the device temperature, and the control circuit correlates temperature with frequency without requiring external measurement equipment. This self-service approach eliminates the need for thermostatic baths or thermostreamers while maintaining measurement capability.
Solution Approach 2:
The semiconductor device measures frequency temperature characteristics at multiple temperatures during the manufacturing process before final assembly. By performing these measurements preliminarily and storing correction data in advance, the need for time-consuming post-assembly temperature characterization is eliminated, reducing overall inspection time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy evaluation and rapid creation of temperature correction data, reducing frequency deviations and shortening the time required for inspection, while eliminating the need for expensive equipment like thermostatic baths or thermostreamers.
Implementation Method 1
a heater configured to heat the oscillation circuit
Implementation Method 2
a temperature sensor configured to detect a temperature of the oscillation circuit
Data Source
AI summary
Provided is a semiconductor integrated circuit including an oscillation circuit configured to output an oscillation signal, a heater configured to heat the oscillation circuit, a temperature sensor configured to detect a temperature of the oscillation circuit, and a nonvolatile memory configured to store temperature correction data. The oscillation circuit controls a frequency of the oscillation signal based on an output signal of the temperature sensor and the temperature correction data.