Crystal Oscillator Package Layout for Stable Resonant Frequency
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional quartz resonator packaging designs allow vibrations from the crystal blank to be transmitted externally, leading to unstable resonant frequencies.
Innovation Solution
A packaging structure for crystal oscillators that includes a package base with a recess, conductive glue, a resonant crystal blank with specific area ratios and openings, and a top cover, which separates the glue from the resonant area to prevent vibration transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the quartz crystal blank is packaged with complete crystal structure, then the electrical connection is simplified, but the vibration from the main vibrating portion is easily transmitted to outside causing unstable resonant frequency
Solution Approach 1:
The crystal blank is divided into distinct functional areas: a resonant area for vibration, a border area for structural support, and a connection area for electrical connection. This segmentation isolates the resonant area from external vibrations while maintaining electrical connectivity through the border and connection areas.
Solution Approach 2:
Different areas of the crystal blank are designed with different properties: the resonant area is optimized for vibration characteristics, the border area provides structural stability and isolation, and the connection area ensures electrical connectivity. This local differentiation allows the resonant area to maintain stable frequency while the border area protects against external vibrations.
2Strength
If the crystal blank is completely enclosed in the package, then the mechanical protection is improved, but the vibration transmission to outside increases
Solution Approach 1:
The packaging structure is segmented into a package base, a top cover, and a side wall with specific opening configurations. The side wall includes openings that allow controlled isolation of vibration while maintaining overall mechanical protection. The border area of the crystal blank extends to the package base, creating a decoupling structure that prevents vibration transmission.
Solution Approach 2:
The border area acts as an intermediary structure between the resonant area and the package base. It provides mechanical support and protection while isolating the resonant vibrations from transmission to the package exterior. The connection area serves as another intermediary that maintains electrical connectivity without transmitting mechanical vibrations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design stabilizes the resonant frequency by reducing the transmission of mechanical vibrations from the resonant crystal blank, enhancing the stability of the resonant frequency.
Implementation Method 1
The border area is formed in the recess through the glue
Implementation Method 2
The top cover shields the quartz crystal blank 11, the glue 13, the first conductive pads 14, the first electrode layer 16, and the second electrode layer 17
Implementation Method 3
The conductive vias are electrically connected to the first conductive pad. The plurality of second conductive pads are formed on the bottom surface of the package base and respectively electrically connected to the conductive vias
Implementation Method 4
Quartz elements have stable piezoelectric characteristics, which can provide accurate and wide reference frequency, clock control, timing functions
Data Source
AI summary
A structure for packaging a crystal oscillator includes a package base, at least one glue, a resonant crystal blank, and a top cover. The top of the package base has a recess. The glue is formed in the recess. The resonant crystal blank has at least one opening, at least one border area, at least one connection area, and a resonant area. The opening is arranged between the border area and the resonant area. The border area is connected to the resonant area through the connection area. The border area is formed in the recess through the glue. The top cover is formed on the top of the package base. The top cover closes the recess, the at least one glue, and the resonant crystal blank.