Oscillator Package Layout for Accurate RF Amplifier Temperature Sensing

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Solution Overview

Problem

Conventional RF energy radiation devices face inaccuracies in temperature detection due to thermal resistance and delay in heat transmission from the RF amplifier to the temperature sensor, leading to errors in temperature measurement and microwave control.

Innovation Solution

An oscillator design that includes a signal generator, power amplifier, and temperature sensor, where the temperature sensor is packaged with the final stage device, allowing for accurate temperature detection and control of microwaves by reducing thermal resistance and detection delay.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the temperature sensor is disposed separately from the final stage device, then the device complexity is reduced, but the temperature detection accuracy deteriorates due to thermal resistance and heat transmission delay

Engineering Contradiction:
Improvedevice complexityVSAvoidtemperature detection accuracy
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The temperature sensor is integrated into the same package as the final stage device, merging the sensing element with the heat-generating component. This co-location eliminates thermal resistance issues and heat transmission delays, enabling accurate real-time temperature monitoring of the final stage device without requiring separate external sensing arrangements.

Inventive Principle:
Principle #5Merging (Combining)

2Measurement precision

If the temperature sensor is disposed in the package including the final stage device, then the temperature detection accuracy is improved, but the device complexity increases

Engineering Contradiction:
Improvetemperature detection accuracyVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The temperature sensor is integrated into the same package as the final stage device, merging the sensing element with the heat-generating component. This co-location eliminates thermal resistance issues and heat transmission delays, enabling accurate real-time temperature monitoring of the final stage device without requiring separate external sensing arrangements.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables precise temperature monitoring of the final stage device, improving the accuracy of microwave generation and reducing the need for circulators and termination resistors, resulting in a more compact and efficient RF energy radiation device.

Implementation Method 1

a difference may occur between the actual temperature of the RF amplifier and the temperature detected by the temperature sensor. This difference is due to an error in the absolute temperature value caused by the thermal resistance from the RF amplifier to the temperature sensor

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250106957A1Oscillator and electric device
Publication Date: 2025.03.27 PANASONIC HOLDINGS CORP
  • US20250106957A1 patent drawing
  • US20250106957A1 patent drawing
  • US20250106957A1 patent drawing

AI summary

An oscillator (1) according to the present disclosure generates output power, and provides a microwave that is in accordance with the output power as an output wave. The oscillator (1) includes a signal generator (10), a power amplifier (20), and a temperature sensor (40). The signal generator (10) generates an oscillation signal. The power amplifier (20) includes a final stage device (22), and amplifies the oscillation signal to generate the output power. The temperature sensor (40) detects a temperature of the final stage device (22). The final stage device (22) is packaged. The temperature sensor (40) is disposed in a package (200) that includes the final stage device (22).