Oscillator Package Structure for Thermal Isolation and Board Positioning
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Solution Overview
Problem
In existing oven controlled crystal oscillators, the positioning of the circuit board relative to the base member is not precise, leading to potential contact and degradation of frequency stability due to temperature fluctuations.
Innovation Solution
An electronic component package with projecting portions on the base member that contact the substrate, creating a defined gap to reduce heat conduction and maintain temperature control accuracy, while also using a regulating member with a spherical shape and glass material to minimize contact area and enhance stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit board is connected to the lower lid cover through lead terminals without positioning, then the assembly is simple, but the circuit board contacts the lower lid cover causing heat conduction and frequency instability
Solution Approach 1:
The patent introduces an insulating member as an intermediary between the lower lid cover and the circuit board. This insulating member has a recess that receives the circuit board, preventing direct contact between the circuit board and the lower lid cover. By placing this intermediary component, heat conduction is blocked while maintaining structural simplicity, thus resolving the contradiction between reliability and device complexity.
2Volume of stationary object
If the circuit board is positioned closer to the lower lid cover, then the package size is reduced, but heat conduction increases affecting temperature control accuracy
Solution Approach 1:
The insulating member serves as a thermal barrier between the lower lid cover and the circuit board. Even when the circuit board is positioned close to the lower lid cover, the insulating member's recess receives the circuit board and prevents direct thermal contact. This allows the package to maintain a compact size while preserving temperature control accuracy by blocking heat conduction paths.
3Ease of manufacture
If the circuit board is disposed inclined without positioning, then manufacturing is easier, but contact with the lower lid cover occurs degrading frequency stability
Solution Approach 1:
The insulating member with its recess provides a positioning structure that naturally guides the circuit board into the correct position during assembly. The recess receives the circuit board, preventing inclination and ensuring proper alignment without requiring complex positioning mechanisms. This maintains ease of manufacture while preventing contact between the circuit board and lower lid cover, thus preserving frequency stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces temperature-induced frequency fluctuations, ensuring high stability and accuracy in the oscillator's output by maintaining precise positioning and minimizing heat transfer between the base member and substrates.
Implementation Method 1
the first projecting portion contacts the first substrate, so that a distance (gap) between the first substrate and the base member can be defined to a predetermined interval, and thus, contact between the first substrate and the base member can be prevented or reduced. Therefore, since heat conduction between the base member and the first substrate can be reduced
Data Source
AI summary
A package includes a base member and a first projecting portion that projects from one surface of the base member. The first projecting portion contacts a first substrate on which an electronic component is mounted, and has an insulating property.