Oscillator Thermal Stability via Intermediary Temperature Control Element

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Solution Overview

Problem

Existing oscillators face temperature instability issues due to heat transfer between the resonator element and the base substrate via bonding wires, which can destabilize the resonator element's temperature.

Innovation Solution

The oscillator design incorporates a temperature control element with relay electrode pads that reduce heat transfer between the resonator element and the base substrate by using multiple bonding wires to couple the temperature control element and the resonator element, ensuring stable temperature control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If bonding wires are used to electrically couple the resonator element and base substrate, then electrical connection is achieved, but heat transfer between the resonator element and base substrate occurs which destabilizes temperature

Engineering Contradiction:

Improvetemperature stabilityVSAvoidheat transfer

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent introduces a temperature control element as an intermediary component between the resonator element and base substrate. This mediator absorbs excess heat from the resonator element through thermal conduction, preventing direct heat transfer to the base substrate and stabilizing the resonator element's temperature. The temperature control element acts as a thermal buffer that maintains temperature equilibrium.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If the coupling area between resonator element and heat generation unit is increased, then heat transfer efficiency is improved, but heat escape to support unit increases which destabilizes temperature

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidheat escape

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The patent applies local quality by creating different thermal coupling characteristics at different locations. The resonator element is positioned with optimized coupling area to the temperature control element (not directly to the base substrate), while the support unit has minimal thermal coupling. This localized thermal management ensures efficient heat transfer where needed while preventing heat escape paths that would destabilize temperature.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration maintains the resonator element's temperature stability, allowing for precise temperature control and efficient heating, thereby enhancing the oscillator's performance.

Implementation Method 1

heat is transferred between the resonator element and the base substrate via the bonding wire

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat generation unit installed at the base substrate

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS10992258B2Oscillator, electronic apparatus, and vehicle

Publication Date: 2021.04.27 SEIKO EPSON CORP

AI summary

An oscillator includes: a base substrate having a first electrode; a temperature control element mounted on the base substrate and having a first pad electrically coupled to the first electrode; a resonator element having a first major surface and a second major surface in front-back relation with the first major surface, and mounted on the temperature control element in such a way that the second major surface faces the temperature control element; and at least one first bonding wire coupling the first major surface and the first pad together.