OTP Memory Array Isolation Modules Reduce Leakage

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Solution Overview

Problem

Conventional OTP memory technologies face issues with high power consumption, reliability, and complex voltage management due to lack of effective isolation and high-voltage impact on MOS transistors, leading to increased leakage currents and complex decoder designs.

Innovation Solution

The proposed OTP memory array incorporates a series of Native MOS transistors as isolation modules between storage and detection MOS transistors, utilizing multiple stages of high-voltage isolation devices to reduce crosstalk and voltage impact, allowing for low-voltage word and bit line selection, and eliminating the need for boost circuits and large decoder structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If no high-voltage isolation device is used, then device complexity is reduced, but reliability of MOS transistors under high-voltage impact deteriorates and leakage currents increase

Engineering Contradiction:
Improveisolation device structureVSAvoidMOS transistor reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent introduces a high-voltage isolation device (first isolation device) as an intermediary component between the bit line and the storage MOS transistor. This isolation device acts as a mediator that protects the storage MOS transistor from direct high-voltage impact while allowing the memory cell to function. The isolation device transfers and isolates the high-voltage signal, preventing harmful effects on the storage transistor.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If no read isolation device is used, then device complexity is reduced, but power consumption increases due to global clearing requirements

Engineering Contradiction:
Improveisolation device structureVSAvoidpower consumption
Core Design Contradiction:
Device complexityVSUse of energy by moving object

Solution Approach 1:

The patent divides the memory array into independently controllable units by introducing a second isolation device (read isolation device) that enables selective row-by-row clearing. This segmentation allows the system to clear only the necessary memory rows rather than performing global clearing operations, significantly reducing power consumption during read operations.

Inventive Principle:
Principle #1Segmentation

3Manufacturing precision

If thick gate oxygen devices are used in medium-high voltage paths, then manufacturing precision is improved, but Vt voltage drop loss increases and read voltage becomes high

Engineering Contradiction:
Improvedevice fabrication qualityVSAvoidVt voltage drop loss
Core Design Contradiction:
Manufacturing precisionVSLoss of energy

Solution Approach 1:

The patent applies different device characteristics to different parts of the circuit based on voltage requirements. Native MOS transistors with zero threshold voltage are used specifically in high-voltage paths (bit line to storage transistor) where voltage drop would be problematic, while conventional MOS transistors can be used in low-voltage paths. This localized optimization of device properties minimizes overall voltage drop and power loss.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11990193B2One time programmable (OTP) memory array and read and write method thereof
Publication Date: 2024.05.21 SICHUAN KILOWAY TECHNOLOGIES CO LTD
  • US11990193B2 patent drawing
  • US11990193B2 patent drawing
  • US11990193B2 patent drawing

AI summary

A one time programmable OTP memory array and a read and write method thereof are provided. The OTP memory array includes M×N OTP memories, the OTP memories each include a storage MOS transistor, a first MOS transistor, a second MOS transistor and a detection MOS transistor, an isolation module is disposed between a control terminal of the detection MOS transistor and the storage MOS transistor; the isolation module includes at least one isolation MOS transistor; and in the array, a gate of each storage MOS transistor is connected to a same storage control point, each isolation MOS transistor is distinguished based on a distance from the storage MOS transistor, and gates of isolation MOS transistors with a same distance from the storage MOS transistor are connected to a same isolation control point.