Overlapping Busbar Arrangement for Semiconductor Modules
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Solution Overview
Problem
Existing busbar arrangements for semiconductor modules suffer from significant magnetic coupling between DC voltage connections, leading to uneven current symmetry and dependent switching behavior, especially in high-frequency applications, which can result in reduced performance and increased parasitic coupling.
Innovation Solution
A busbar arrangement with overlapping busbars, where the webs are aligned to form a first axis intersecting a second axis at an angle between 0° and 45°, and include insulating areas to prevent current flow perpendicular to the second axis, minimizing magnetic coupling and allowing parallel current flow, thus reducing magnetic field interactions between connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If busbars are arranged to overlap to reduce inductance, then low-inductance connection is achieved, but magnetic coupling between DC voltage connections increases
Solution Approach 1:
The busbar is divided into separate webs for different voltage connections, with each web independently positioned and insulated. This segmentation allows the magnetic fields from adjacent webs to cancel each other out while maintaining low inductance through the overlapping arrangement.
Solution Approach 2:
The webs are arranged asymmetrically with different orientations relative to each other. By positioning the webs at different angles and locations within the overlapping area, the magnetic field distribution is optimized to achieve cancellation effects while maintaining electrical insulation.
2Volume of moving object
If busbars are placed close together to reduce inductance, then compact design is achieved, but electrical insulation between busbars becomes difficult
Solution Approach 1:
An insulating layer is introduced between the overlapping busbars to provide electrical insulation. This intermediary element allows the busbars to be positioned close together for low inductance while preventing electrical breakdown through the insulation barrier.
Solution Approach 2:
The insulation problem is solved by adding a dimensional element (the insulating layer) between the busbars, allowing them to overlap in the plane while maintaining electrical separation through the thickness dimension.
3Power
If multiple semiconductor modules are connected in parallel to increase power, then power capacity increases, but current symmetry between modules deteriorates
Solution Approach 1:
The busbar arrangement creates equipotential regions that ensure equal voltage distribution to all parallel-connected semiconductor modules. By optimizing the web positions and orientations, the electrical path length and impedance are equalized, ensuring symmetric current sharing.
Solution Approach 2:
The geometric parameters of the busbar webs (position, orientation, dimensions) are optimized to minimize inductance differences between parallel module connections. This parameter optimization ensures that all modules experience identical electrical conditions for symmetric operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces magnetic coupling between semiconductor modules, enhancing current symmetry, independent operation of modules, and minimizing parasitic magnetic field effects, allowing for compact, efficient, and high-performance power converter designs.
Implementation Method 1
This configuration significantly reduces magnetic coupling between semiconductor modules, enhancing current symmetry, independent operation of modules, and minimizing parasitic magnetic field effects
Data Source
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AI summary
In summary, the invention relates to a busbar arrangement (1) for making electrical contact with at least one semiconductor module (2), wherein the busbar arrangement (1) has at least two busbars (11), wherein the busbars (11) are arranged in a mutually overlapping manner at least in an overlap region (13) of the busbar arrangement (1), wherein the busbars (11) are electrically insulated from one another, wherein the busbars (11) each have at least one web (20) with a connection element (21), wherein the webs (20) of the busbars (11) are arranged without an overlap. In order to reduce the interaction between the connections of the semiconductor module or of the semiconductor modules, it is proposed to orient the webs (20) in such a way that a first axis (31) can be formed, which first axis runs through the connection element (21) of the respective web (20) and to a point of a transition (19) of the respective web (20) to the overlap region (13) of the busbar arrangement (1), and which first axis intersects a second axis (32), which is formed by a connection of two connection elements (21) of the webs (20), at an angle of between 0° and 45°, wherein the busbars (11) each have an insulating region (14) which is arranged in such a way as to reduce or to prevent a current in the web (20) in a direction perpendicular to the second axis (32). The invention further relates to a converter module (3) comprising a busbar arrangement (1) of this kind.