Overlapping Transistor Display Layout for High-Resolution Emission
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Solution Overview
Problem
Existing display devices face challenges in achieving high resolution while maintaining element reliability and improving light emission efficiency.
Innovation Solution
A display device design that includes a substrate with a transparent electrode, a reflective electrode, a transistor on the reflective electrode, and a light emitting element between the transparent and reflective electrodes, where the transistor overlaps the light emitting element, enhancing element reliability and light emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transistor is formed before bonding the light emitting element, then the manufacturing process is simpler, but element reliability is reduced
Solution Approach 1:
The patent applies preliminary action by bonding the light emitting element to the first electrode before forming the transistor. Specifically, the light emitting element is directly bonded to the first electrode in advance, and then the transistor is formed on the first electrode. This sequence ensures that the light emitting element is securely attached before subsequent processing steps, thereby improving element reliability while managing manufacturing complexity through a structured process flow.
2Use of energy by moving object
If a reflective electrode is added to improve light emission efficiency, then light emission efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the reflective electrode function with the existing electrode structure. The second electrode is configured as a reflective electrode that is electrically connected to the first electrode through the light emitting element. This integration allows the reflective function to be incorporated into the existing electrical connection pathway, improving light emission efficiency by reflecting light back through the light emitting element while avoiding additional separate structural components.
3Manufacturing precision
If the transistor is disposed to overlap the light emitting element, then high resolution is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes the vertical dimension to achieve high resolution. The transistor is disposed to overlap the light emitting element in the vertical direction (thickness direction), allowing the active area of the transistor to extend beyond the lateral boundaries of the light emitting element. This vertical stacking approach enables high resolution display without requiring extremely precise lateral alignment, as the overlapping relationship is established through vertical layering rather than lateral positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution improves element reliability by forming the transistor after directly bonding the light emitting element on a first electrode and enhances light emission efficiency by using a reflective electrode, thereby facilitating the creation of high resolution display devices.
Implementation Method 1
a reflective electrode on the transparent electrode
Data Source
AI summary
A display device includes: a substrate; a transparent electrode on one surface of the substrate; a reflective electrode on the transparent electrode; a transistor on the reflective electrode; and a light emitting element between the transparent electrode and the reflective electrode. The transistor overlaps the light emitting element.