Overmolding Vertical Mount Connector Headers
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Solution Overview
Problem
Existing overmolding processes for electronic assemblies with insert-molded connectors face challenges in preventing distention of connector headers and circuit boards due to packing pressure during encapsulation, particularly when using vertical mount connectors.
Innovation Solution
The method involves using connector inserts, preferably made of tool steel, placed between the connector header and the mold floor to support the assembly and prevent distention, while ensuring the encapsulant fills voids inboard of the connector header, thereby maintaining the structural integrity of both components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the encapsulant is injected to fill voids and provide sealing, then the sealing and protection are improved, but the packing pressure causes distention of the connector header and circuit board
Solution Approach 1:
A support structure is introduced as an intermediary element between the encapsulant and the connector header/circuit board. This support structure absorbs the packing pressure from the encapsulant while preventing it from distending the delicate components, thus allowing full encapsulation for sealing without compromising the shape integrity of the connector header and circuit board
2Strength
If the connector header is insert-molded for structural integration, then the structural integrity is improved, but the packing pressure during encapsulation causes distention of the connector header
Solution Approach 1:
The support structure serves as a mediator that protects the insert-molded connector header from distention during encapsulation. It allows the connector header to maintain its integrated structural role while preventing the encapsulant pressure from deforming its shape
Solution Approach 2:
The support structure is placed in position before the encapsulant is injected, providing pre-positioned cushioning and support. This beforehand protection prevents the connector header from experiencing distention forces during the encapsulation process, preserving both its structural integrity and shape
Data Source
AI summary
An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between the connector header and the circuit board. The electronic assembly is then placed in a mold for plastic encapsulation. The floor of the mold has a well sized to accommodate the conductor pins and shroud of the connector header, and the connector header has a peripheral flange that seats against the floor of the mold to keep encapsulant out of the well. Encapsulant fills open spaces inboard of the connector header, and a connector insert disposed between the connector header and the floor of the well prevents distention of the connector header and circuit board due to the packing pressure of the encapsulant.