Oxide Layer Adhesion for Flexible Display Wiring
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Solution Overview
Problem
Flexible organic light emitting display apparatuses face issues with cracking of routing wiring due to stress, leading to short circuits when the buffer and insulation layers are vulnerable, and partial detachment of wiring from the substrate when these layers are removed to facilitate bending.
Innovation Solution
Incorporating an oxide thin layer between the substrate and the routing wiring to enhance adhesive force and prevent cracking, while allowing for easy bending by removing the buffer and insulation layers in the bending area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the buffer layer and insulation layer are removed from the bending area to facilitate bending, then bending is easily performed, but the adhesive force between routing wiring and substrate decreases causing partial detachment
Solution Approach 1:
An adhesive layer is introduced as an intermediary between the routing wiring and the substrate in the bending area. This adhesive layer specifically enhances the bonding strength at this critical interface, preventing detachment while allowing the buffer and insulation layers to be removed for easy bending. The adhesive layer acts as a mediator that compensates for the loss of structural support from removing the other layers.
Solution Approach 2:
The adhesive layer is applied selectively only in the bending area where it is most needed, rather than uniformly across the entire device. This localized application provides enhanced adhesion precisely where bending stresses are concentrated, while maintaining the overall flexibility of the device. The local quality approach optimizes the balance between adhesion and flexibility.
2Length of moving object
If the degree of bending increases to narrow the bezel, then the bezel size is reduced, but the buffer layer and insulation layer crack and routing wiring short circuits occur
Solution Approach 1:
The adhesive layer serves as a protective intermediary that strengthens the bonding between the routing wiring and substrate, preventing cracks from propagating through the wiring during high-degree bending. This mediator ensures electrical continuity is maintained even when the device is bent to achieve narrow bezel dimensions.
Solution Approach 2:
The adhesive layer is applied in advance to the bending area to provide preemptive protection against cracking. By strengthening the bonding interface before bending occurs, the adhesive layer cushions the routing wiring against the stresses of high-degree bending, preventing short circuits and maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The oxide thin layer strengthens the adhesive force between the substrate and routing wiring, preventing partial detachment and cracking, thus enabling flexible bending without compromising the display apparatus' integrity.
Implementation Method 1
an oxide thin layer provided between the substrate and the routing wiring
Data Source
AI summary
An organic light emitting display apparatus can include a substrate including a display area and a bending area, a routing wiring disposed in the bending area of the substrate, and an oxide thin layer disposed between the substrate and the routing wiring.