Oxide Semiconductor Pad Stabilizing Adhesion and Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional display devices face issues with adhesion and increased resistance in the pad area due to material differences between the display and pad regions, leading to defects and reduced efficiency during manufacturing.
Innovation Solution
The formation of an oxide semiconductor layer on the buffer layer in the pad area, using materials like amorphous zinc oxide, allows for simultaneous processing with the display area, stabilizing the interface and reducing gap formation, thereby improving adhesion and reducing resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate processes are used to coat materials in the pad area, then adhesion issues are addressed, but manufacturing efficiency and accuracy are reduced
Solution Approach 1:
The patent combines the coating processes for the display area and pad area into a single integrated manufacturing sequence. By planning the coating process to sequentially treat different regions with appropriate materials in one continuous operation, the patent avoids the need for separate independent processes, thereby maintaining manufacturing efficiency while ensuring proper adhesion in the pad area.
2Reliability
If the pad area is processed independently from the display area, then specific pad requirements are met, but manufacturing complexity and cost increase
Solution Approach 1:
The patent employs a universal coating system that can deposit both organic and inorganic materials through a single equipment setup. The coating apparatus is designed to handle multiple material types and can switch between depositing organic light-emitting materials for the display area and inorganic insulating materials for the pad area, eliminating the need for separate specialized equipment and reducing manufacturing complexity.
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
Disclosed are a display device and a method of fabricating the same. A pad for a display device includes: an oxide semiconductor layer (617) formed on a substrate (300); a lower insulation layer (625) formed on the oxide semiconductor layer (617) to at least partially overlap the oxide semiconductor layer (617); one or more line layers (635, 655) formed on the lower insulation layer (625); an upper insulation layer (665) formed on the one or more line layers (635, 655); and a pad electrode (675) formed on the upper insulation layer (665) and connected to the one or more line layers (635, 655) through a contact hole formed in the upper insulation layer (665).