Oxygen Gas Pipe Temperature Switching in Substrate Processing
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Solution Overview
Problem
The existing methods for processing substrates in semiconductor manufacturing fail to effectively suppress the increase in pipe temperature due to reactions between metal-containing pipe surfaces and oxygen-containing gases, leading to potential burnout of pipe accessories and contamination.
Innovation Solution
A technique involving a two-step process where the substrate is first processed with a first processing gas through a heated pipe, and then treated with an oxygen-containing gas through a pipe whose temperature is lowered, preventing oxidation reactions and maintaining the pipe temperature below a critical level.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If oxygen-containing gas is supplied through a metal-containing pipe at high temperature, then substrate processing can be performed efficiently, but the pipe temperature increases due to oxidation reactions between the pipe surface and gas
Solution Approach 1:
The pipe is heated to a first temperature (higher than the second temperature) before supplying the oxygen-containing gas. This preliminary heating prevents condensation of moisture on the pipe inner surface, which would otherwise cause oxidation reactions and temperature increase during gas supply
Solution Approach 2:
The pipe temperature is controlled to change between two states: a first temperature (higher) during oxygen-containing gas supply to prevent moisture condensation and oxidation, and a second temperature (lower) during other processing steps. This parameter change optimizes both productivity and temperature control
2Reliability
If the pipe temperature is maintained at high level to prevent oxidation, then pipe reliability is improved, but energy consumption increases and contamination risk rises
Solution Approach 1:
The pipe temperature is periodically adjusted between a first temperature (during oxygen-containing gas supply) and a second temperature (during other processing). This periodic action maintains reliability only when necessary, reducing overall energy consumption compared to continuous high-temperature maintenance
3Use of energy by moving object
If the pipe temperature is lowered to prevent oxidation reactions, then energy consumption is reduced, but moisture condensation occurs on the pipe surface
Solution Approach 1:
The pipe is heated to a first temperature before oxygen-containing gas supply to prevent moisture condensation. This preliminary action eliminates the harmful effect of condensation that would occur if the pipe were kept at lower temperature
Solution Approach 2:
The pipe temperature is periodically raised to the first temperature during oxygen-containing gas supply to prevent condensation, then lowered to the second temperature afterward. This periodic heating minimizes energy consumption while preventing harmful condensation only when necessary
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses pipe temperature increases, preventing burnout and contamination, while improving substrate processing efficiency and reducing contamination risks.
Implementation Method 1
the second pipe is heated to a first temperature or higher
Implementation Method 2
a temperature of the second pipe is lowered to a second temperature lower than the first temperature
Data Source
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AI summary
There is provided a technique that includes (a) performing a first process to a substrate accommodated in a process container by supplying a first processing gas into the process container through a first pipe different from a second pipe, which is connected to the process container and includes an inner surface made of a metal-containing material, in a state in which the second pipe is heated to a first temperature or higher and (b) performing a second process to the substrate by supplying a second processing gas containing oxygen into the process container through the second pipe in a state in which a temperature of the second pipe is lowered to a second temperature lower than the first temperature.