High-Frequency Module Power Amplifier Mounting for Faster Heat Transfer
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Solution Overview
Problem
The heat dissipation performance of power amplifiers in high frequency modules is compromised due to a long heat dissipation path, which decreases their efficiency.
Innovation Solution
The power amplifier is positioned on the second main surface of the mounting board, with a through via connecting it to a connection member that allows for efficient heat transfer to an external board, shortening the heat dissipation path and enhancing heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the power amplifier is disposed on the first main surface of the mounting board and heat is dissipated through the via, metal block, and terminal to the external board, then the heat dissipation path is established, but the heat dissipation path is long and heat dissipation performance is decreased
Solution Approach 1:
The power amplifier is inverted from its conventional position on the first main surface to the second main surface of the mounting board, directly facing the external board. This inversion repositions the heat-generating component closer to the heat dissipation destination, fundamentally reversing the heat flow path direction to achieve shorter heat dissipation distance and improved thermal performance.
Solution Approach 2:
The invention transitions the power amplifier from a planar arrangement on the first main surface to a three-dimensional configuration on the second main surface, utilizing the vertical dimension through the mounting board thickness. This dimensional change enables direct thermal coupling with the external board via the connection member, creating a more efficient heat dissipation pathway that exploits the Z-axis dimension.
2Temperature
If the power amplifier is disposed on the second main surface with a through via connecting to the connection member, then the heat dissipation path is shortened and heat dissipation performance is improved, but the structural configuration becomes more complex
Solution Approach 1:
The connection member serves multiple functions simultaneously: it provides electrical connection between the power amplifier and external board, acts as a heat dissipation pathway, and provides mechanical support. This multi-functionality reduces the need for separate dedicated heat sink structures, thereby improving heat dissipation performance without proportionally increasing structural complexity.
Solution Approach 2:
The invention merges the electrical connection function and heat dissipation function into a single integrated pathway through the through via and connection member. By combining these two functions that were previously separate (electrical traces for signal and thermal mass for heat dissipation), the structure achieves efficient heat dissipation without requiring additional complex thermal management components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the heat dissipation performance of the power amplifier by rapidly dissipating heat to the external board, thereby enhancing the overall efficiency of the high frequency module.
Implementation Method 1
heat generated in the power amplifier is transferred and dissipated to an external board, which is connected to the terminal, through the via, the metal block, and the terminal in the mounting board
Data Source
AI summary
A high frequency module capable of improving a heat dissipation performance of a power amplifier includes a mounting board, a power amplifier, and a connection member. The mounting board has a first main surface facing a second main surface. The power amplifier is disposed on the second main surface of the mounting board. The connection member is connectable to an external board. The power amplifier includes a base material, a transistor, and a through via. The base material has a third main surface facing a fourth main surface, and the third main surface is disposed between the second main surface and the fourth main surface. The transistor is disposed on the third main surface of the base material. The through via is provided between the third main surface and the fourth main surface. The through via is connected to the connection member.