Semiconductor Package Structure With Adhesive Walls for TIM Voids
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Solution Overview
Problem
Existing package structures in semiconductor devices, such as Package-on-Package (PoP) technology, face challenges in achieving optimal integration density and thermal management due to voids and defects in thermal interface materials, which affect performance and reliability.
Innovation Solution
The introduction of multiple adhesive walls to confine thermal interface material within a predetermined region, with controlled dimensions and strategically placed openings to relieve pressure, reducing voids and defects, and enhance thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thermal interface material is applied without adhesive walls, then the application process is simple, but voids and defects occur in the thermal interface material
Solution Approach 1:
The patent divides the packaging structure into multiple adhesive walls that segment the space above the first package component. These adhesive walls create distinct regions that confine the thermal interface material, preventing it from spreading uncontrollably and reducing voids and defects in the material application.
2Manufacturing precision
If adhesive walls are added to confine thermal interface material, then voids and defects are reduced, but the package structure becomes more complex
Solution Approach 1:
The adhesive walls serve multiple functions simultaneously: they act as barriers to confine the thermal interface material, provide structural support for the package components, and facilitate the bonding process. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in overall structural complexity.
3Reliability
If thermal interface material is confined to a predetermined region, then thermal management is improved, but the area for heat dissipation is reduced
Solution Approach 1:
The adhesive walls create a predetermined region with concentrated thermal interface material directly over the first package component, ensuring optimal thermal contact where heat generation is highest. This local concentration of thermal material improves heat transfer efficiency at the critical interface while allowing other areas to maintain adequate heat dissipation pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves thermal management and reduces manufacturing costs by minimizing voids and defects in thermal interface materials, thereby enhancing the reliability and performance of semiconductor packages.
Implementation Method 1
a thermal interface material over the first package component
Implementation Method 2
multiple adhesive walls to confine thermal interface material within a predetermined region
Data Source
AI summary
A package structure is provided. The package structure includes a first package component and a second package component bonded to the first package component. The package structure includes an electronic component disposed on the second package component. The package structure includes a thermal interface material over the first package component. The package structure includes a first adhesive wall located between the first package component and the electronic component. The package structure also includes a lid structure bonded to the second package component.