Semiconductor Package Alignment Structure with Rounded Edges
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Solution Overview
Problem
Existing semiconductor package structures face issues with stress concentration and cracking due to sharp edges and corners in alignment features, which affect the reliability and performance of the package.
Innovation Solution
The formation of alignment structures with rounded edges and conductive marks between dielectric layers, along with step-shaped trenches, to reduce stress concentration and prevent cracking, while maintaining alignment functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sharp edges and corners are used in alignment features, then manufacturing precision is improved, but stress concentration and cracking occur reducing reliability
Solution Approach 1:
The patent applies curvature by replacing sharp edges and corners in alignment features with rounded edges and corners. Specifically, the alignment marks and openings are designed with curved geometries instead of sharp angular features, which eliminates stress concentration points while preserving the alignment functionality. This directly resolves the contradiction by maintaining manufacturing precision through defined curved geometries while eliminating the reliability issues caused by stress concentration at sharp edges.
2Reliability
If rounded edges are used in alignment features, then stress concentration is reduced improving reliability, but manufacturing precision may deteriorate
Solution Approach 1:
The patent applies parameter changes by carefully controlling the radius of curvature in rounded alignment features. The curvature radius is optimized to be sufficiently large to eliminate stress concentration and improve reliability, yet sufficiently small to maintain adequate alignment precision. This parameter optimization resolves the contradiction by finding the optimal balance point where rounded edges provide stress relief without compromising the functional requirements of alignment.
Data Source
AI summary
A method for forming a package structure and method for forming the same are provided. The method includes forming a package layer over a substrate, and forming a first dielectric layer over the package layer. The method further includes forming a first alignment mark and a second alignment mark over the first dielectric layer. The method includes forming a second dielectric layer over the first dielectric layer and removing a portion of the second dielectric layer to form a first trench to expose the first alignment mark, and to form a first opening to expose the second alignment.