Electronic Device Package Barrier Layer Moisture Protection
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Solution Overview
Problem
Electronic devices, particularly organic thin film transistor (OTFT) arrays, are susceptible to degradation due to moisture and oxygen permeation through the sides of their packages, leading to reduced service life and unsatisfied consumer requirements.
Innovation Solution
An electronic device package is designed with a carrying board, an electronic device, a first insulating layer, and a barrier layer that includes a sidewall contact portion and an extending portion to prevent moisture ingress, featuring a concave-convex surface and materials like SiNx or SiOx, along with a sidewall block structure to form a stopper wall and enhance moisture impermeability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the film layers extend from the central portion to the edge portion of the OTFT array, then the electronic device can be fully formed and functional, but moisture and oxygen can permeate into the film layers through the sides, accelerating degradation and reducing service life
Solution Approach 1:
The barrier layer is extended from a traditional planar configuration into the vertical dimension by forming sidewall portions that extend upward from the planar surface. These sidewall portions rise above the top surfaces of the insulating layers and overlap with the film layers, creating a three-dimensional barrier structure that blocks moisture permeation paths without interfering with the horizontal functionality of the electronic device.
Solution Approach 2:
The barrier layer is formed as a thin film structure with specific material composition (including inorganic barrier materials) that provides effective moisture blocking. The thin film is configured to extend laterally beyond the film layers and form vertical sidewall portions, creating a flexible yet effective moisture barrier that adapts to the device geometry while maintaining protection.
2Object-affected harmful factors
If a barrier layer is added to prevent moisture ingress, then moisture impermeability is improved, but the device structure becomes more complex
Solution Approach 1:
The barrier layer is integrated with the existing insulating layers and film layers of the electronic device. The barrier layer is formed to overlap with these existing structures, merging the moisture protection function with the device's structural components rather than adding completely separate protective elements.
Solution Approach 2:
The barrier layer serves multiple functions: it provides moisture blocking, extends laterally to protect edge regions, forms vertical sidewall portions to block side permeation paths, and integrates with existing device structures. This multi-functional design achieves comprehensive protection without proportionally increasing structural complexity.
Data Source
AI summary
An electronic device package includes a carrying board, an electronic device, a first insulating layer, and a barrier layer. The carrying board includes a central area, an inner edge area, and an outer edge area. The inner edge area is located between the central area and the outer edge area. The electronic device is located in the central area. The first insulating layer is located on the carrying board and overlapped with the electronic device and extends from the central area to the inner edge area. The barrier layer is located on the carrying board. Here, the barrier layer includes a sidewall contact portion and an extending portion. The sidewall contact portion surrounds a side surface of the first insulating layer, and the extending portion extends from the sidewall contact portion to the outer edge area in a direction away from the first insulating layer.