Package Board Fiber Layer Warpage Control
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Solution Overview
Problem
The miniaturization of semiconductor packages leads to reduced substrate thickness, causing warpage issues in package boards, which can result in non-wetting problems with semiconductor devices and handling challenges during manufacturing.
Innovation Solution
A package board with a stack structure comprising a circuit layer and a fiber layer, where the fiber layer includes non-woven first fibers extending in a specific direction, providing increased bending stiffness to minimize warpage. The fiber layer is designed with distinct regions, including areas where it overlaps and does not overlap the circuit pattern, with woven fibers in certain regions to enhance stiffness and prevent warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the package substrate is reduced to achieve miniaturization, then the size of the semiconductor package is reduced, but warpage of the substrate increases
Solution Approach 1:
The patent applies composite materials by combining fiber layers (providing mechanical strength and stiffness) with insulating layers (providing electrical insulation) to create a multi-layer package substrate structure. This composite construction allows the substrate to maintain dimensional stability and resist warpage even when the overall thickness is reduced for miniaturization, thus resolving the contradiction between small size and structural stability
Solution Approach 2:
The patent implements local quality by creating regions with different fiber orientations and densities within the substrate structure. Specific areas have fibers oriented to provide enhanced stiffness in directions where warpage is most likely to occur, while other regions maintain different properties. This localized optimization allows the substrate to resist warpage in critical areas without increasing the overall size of the package
2Volume of moving object
If the thickness of the package substrate is reduced, then miniaturization is achieved, but handling difficulty increases due to warpage
Solution Approach 1:
The multi-layer composite structure combining fiber-reinforced layers with insulating layers provides inherent rigidity and dimensional stability to the thin substrate. This composite construction enables the substrate to maintain its shape and flatness during manufacturing processes, making handling easier despite the reduced thickness required for miniaturization
3Volume of moving object
If the thickness of the package substrate is reduced, then miniaturization is achieved, but non-wetting problems with semiconductor devices occur
Solution Approach 1:
The patent applies local quality by optimizing the fiber distribution and orientation in specific regions of the substrate, particularly in areas where semiconductor devices will be mounted. This localized structural optimization ensures flat, stable surfaces in device mounting regions, providing proper wetting quality and reliable electrical connections without increasing the overall substrate thickness
Data Source
AI summary
A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.