Semiconductor Package Compensation Layer for Heat Dissipation
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Solution Overview
Problem
The challenge of heat dissipation in semiconductor devices leads to performance degradation, reliability issues, and potential physical damage due to heat accumulation, which affects the performance and lifespan of electronic systems.
Innovation Solution
A semiconductor package design incorporating a compensation layer with higher thermal conductivity substrates and through-electrodes that enhance heat dissipation by reinforcing the substrate thickness and facilitating signal and power transfer between semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor devices are designed with higher capacity and integration density, then performance is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent introduces a compensation layer positioned between the semiconductor chip and the printed circuit board, creating an additional thermal management dimension. This compensation layer with higher thermal conductivity than the PCB provides a dedicated heat dissipation pathway that operates independently from the electrical connection layer, allowing simultaneous achievement of high integration density and effective heat dissipation.
Solution Approach 2:
The compensation layer acts as an intermediary thermal management component between the heat-generating semiconductor chip and the PCB. This intermediate layer with superior thermal conductivity properties facilitates heat transfer from the chip to the PCB without interfering with the electrical signaling functions, effectively mediating the thermal challenge posed by high integration density.
2Reliability
If heat is continuously accumulated in the semiconductor device, then performance is maintained temporarily, but reliability deteriorates due to physical damage and malfunction
Solution Approach 1:
The patent extracts the thermal management function from the PCB structure by introducing a separate compensation layer dedicated solely to heat dissipation. This separation allows the PCB to focus on electrical functions while the compensation layer handles thermal extraction, preventing heat accumulation that would otherwise compromise device reliability.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the structure between the semiconductor chip and PCB by introducing a compensation layer with higher thermal conductivity than the PCB. This parameter change enhances the heat dissipation capability, preventing heat accumulation and improving device reliability under continuous operation.
3Temperature
If a compensation layer with higher thermal conductivity is introduced to improve heat dissipation, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The compensation layer is designed to serve multiple functions: it provides enhanced heat dissipation due to its higher thermal conductivity, maintains electrical isolation between the semiconductor chip and PCB, and supports mechanical alignment. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving improved heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation performance, enhances reliability, and maintains the integrity of semiconductor devices by effectively managing heat generated during operation.
Implementation Method 1
A semiconductor package design incorporating a compensation layer with higher thermal conductivity substrates and through-electrodes that enhance heat dissipation
Data Source
AI summary
A semiconductor package includes a first semiconductor chip and second semiconductor chips. The first semiconductor chip includes a first semiconductor substrate, first through-electrodes, a power wiring pattern connected to a portion of the first through-electrodes, and a compensation layer disposed on the first semiconductor substrate. The second semiconductor chips are disposed on the first semiconductor chip, each including a second semiconductor substrate. The compensation layer includes a compensation substrate, and a compensation through-electrodes that are electrically connected to a portion of the first through-electrodes, each second semiconductor chip includes second through-electrodes, and a portion of the first through-electrodes are electrically connected to a portion of the second through-electrodes through the compensation through-electrodes.