Semiconductor Package Cooling Pipes With Turbulent Flow Control
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Solution Overview
Problem
Conventional semiconductor packages struggle with inefficient heat dissipation, leading to potential failure due to overheating, as existing cooling systems are typically external and do not effectively manage heat generated by integrated circuits.
Innovation Solution
The implementation of a semiconductor package design that includes a spacer with junction cooling pipes between substrates, which can be embedded within or coupled to the substrates, and incorporates flow control devices to enhance heat dissipation by inducing turbulent flow of cooling medium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If external cooling systems (single or dual heat sinks) are used, then the structure is simple and ease of manufacture is improved, but thermal resistance is high and cooling efficiency deteriorates
Solution Approach 1:
The cooling system is merged with the semiconductor package structure itself. Cooling pipes are integrated within the substrate and spacer layers, and heat sinks are combined with the package housing, creating a unified thermal management system that directly addresses heat at the source rather than relying on separate external components
Solution Approach 2:
The cooling pipes are nested within the substrate and spacer structures. The substrate contains embedded cooling pipes, which are further nested within the package housing that also incorporates heat sink features, creating a multi-layer nested cooling architecture that maximizes thermal contact area
2Reliability
If junction cooling pipes are integrated within substrates and spacers, then thermal resistance is reduced and cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The substrate and spacer components perform multiple functions: they provide structural support for the semiconductor dies while simultaneously serving as conduits for cooling pipes. The package housing also functions as both protective enclosure and heat sink, reducing the need for separate dedicated cooling components
Solution Approach 2:
The semiconductor package structure itself provides the cooling function through integrated pipes within the substrate and spacer. The system serves its own thermal management needs without requiring separate external cooling devices, as the package housing and internal structures actively participate in heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat dissipation capabilities, achieving thermal resistance reductions up to 10 times better than traditional dual cooling systems, enhancing reliability and performance by keeping integrated circuits cooler.
Implementation Method 1
a junction cooling pipe therethrough
Implementation Method 2
The wall of the junction cooling pipe may include a dielectric material
Implementation Method 3
semiconductor packages with direct junction cooling systems... that dissipates the excess heat
Data Source
AI summary
Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.