Liquid-Cooled Package Cover Structure for Direct Chip Heat Removal
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Solution Overview
Problem
Current electronic component packaging systems are inadequate in effectively dissipating heat generated during operation, leading to potential damage and performance degradation due to accumulated heat.
Innovation Solution
A package assembly design featuring a substrate, electronic component, cover with heat dissipation space, and tubes for cooling liquid flow, which includes thermal interface material and pumps to enhance heat transfer and dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging systems are used, then device simplicity is maintained, but heat dissipation efficiency is insufficient leading to heat accumulation
Solution Approach 1:
The packaging structure is segmented into distinct functional zones: a chamber for the electronic component, a heat dissipation space surrounding the chamber, and integrated cooling channels. This segmentation allows heat to be managed in dedicated regions, improving thermal performance without requiring complete redesign of the entire package.
Solution Approach 2:
The cover structure merges multiple functions: it seals the chamber containing the electronic component, creates the heat dissipation space, and incorporates cooling channels directly within its body. This integration improves heat dissipation while avoiding the complexity of separate cooling systems.
2Temperature
If heat dissipation structures are added, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The cooling liquid circulation system serves multiple purposes: it cools the electronic component through the chamber walls, dissipates heat through the heat dissipation space, and can be extended to cool additional components. This multi-functionality improves heat dissipation efficiency while avoiding the need for separate cooling systems for different components.
3Temperature
If thermal interface material is used, then heat transfer is improved, but manufacturing complexity increases
Solution Approach 1:
The thermal interface material acts as an intermediary substance between the electronic component and the cooling structure. It fills microscopic gaps and improves thermal contact, significantly enhancing heat transfer from the component to the cooling channels while requiring only simple application procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces thermal resistance and improves heat dissipating efficiency, effectively preventing damage and maintaining performance by efficiently transferring heat away from the electronic component.
Implementation Method 1
The first thermal interface material is disposed in the chamber and sandwiched in between the electronic component and the top portion
Implementation Method 2
The first tube is connected to the first side portion and communicates with the heat dissipation space. The second tube is connected to the second side portion and communicates with the heat dissipation space
Data Source
AI summary
A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.