Semiconductor Package EM Shielding Structure for SerDes Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor packages face challenges in meeting signal integrity requirements due to parasitic capacitance and half-wave resonant structures in high-speed SerDes circuits, leading to excessive crosstalk and insertion loss, which degrade system performance.
Innovation Solution
An electromagnetic (EM) shielding structure is integrated into the semiconductor package core layer, utilizing built-in differential coaxial configurations with dielectric and copper materials to block EM interference and suppress resonant radiation, fabricated using current semiconductor processing technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If higher bandwidth and faster SerDes circuits are implemented to meet data center demands, then data transmission speed is improved, but signal integrity deteriorates due to excessive crosstalk and insertion loss from half-wave resonance
Solution Approach 1:
An electromagnetic shielding structure is introduced as an intermediary element between signal traces and reference planes. This shielding structure, comprising conductive material layers positioned at specific heights above and below the core layer, mediates the electromagnetic field distribution to suppress half-wave resonance and reduce crosstalk, thereby maintaining signal integrity at high transmission speeds
Solution Approach 2:
The invention changes the electromagnetic field distribution parameters by introducing shielding structures at optimized positions (first height above core layer, second height below core layer). This parameter modification alters the resonant characteristics of the transmission line, suppressing half-wave resonance and reducing insertion loss while maintaining high-speed signal transmission
2Object-affected harmful factors
If traditional electromagnetic shielding methods are used, then some level of shielding is provided, but shielding performance is insufficient and substrate dimensions become larger
Solution Approach 1:
The electromagnetic shielding structure employs a nested configuration where conductive shielding layers are positioned both above and below the core layer containing the signal traces. This nested doll-like structure, with shielding elements at multiple levels, provides enhanced EM radiation suppression within a compact vertical footprint, improving shielding performance without proportionally increasing substrate area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The EM shielding structure effectively reduces crosstalk and insertion loss, enhancing signal integrity in high-speed data transmission circuits by suppressing half-wave EM radiation, thereby improving performance in high-frequency applications.
Implementation Method 1
An electromagnetic shielding structure is integrated into the semiconductor package core layer, utilizing a differential coaxial design with dielectric material and copper coating, which can be fabricated using existing semiconductor processing technology, to block half-wave EM radiation and reduce resonant crosstalk
Data Source
AI summary
An EM shielding structure for a semiconductor package is embedded in a through hole of a core layer of the semiconductor package. The EM shielding structure may include multiple vias formed by a copper plating operation. Additionally, a metal way surrounds the EM shielding structures and prevents, along with a dielectric material, unwanted EM radiation (passing through the vias) from emanating throughout the semiconductor package. The EM shielding structure can also take the form of an insert that is adhered to the core layer at a through hole of the core layer.