Electronic Component Package Frame Protrusion Stress Alleviation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic component packages face challenges in minimizing stress concentration and warpage, which can lead to cracks due to differences in thermal expansion coefficients, particularly in miniaturized components with multiple pins.
Innovation Solution
The proposed electronic component package incorporates a frame with a protrusion formed by filling a trench or through hole with a material of lower rigidity than the frame, which alleviates stress concentration by providing a buffering effect and enhancing package reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rigid frame structure is used to maintain package integrity, then structural strength is improved, but stress concentration and warpage increase due to thermal expansion differences
Solution Approach 1:
The frame structure is designed with localized varying rigidity: rigid portions maintain overall structural integrity, while flexible portions (with lower rigidity) are strategically positioned to reduce stress concentration and accommodate thermal expansion differences, thereby resolving the contradiction between structural strength and stress concentration
Solution Approach 2:
The frame is constructed as a composite structure combining materials or regions with different rigidity properties. The rigid portions provide structural support while flexible portions absorb thermal stress, creating a composite system that simultaneously achieves structural strength and reduced stress concentration
2Stability of the object's composition
If the frame rigidity is increased to prevent deformation, then structural stability is improved, but warpage increases due to thermal expansion coefficients
Solution Approach 1:
The frame employs local quality variation where different portions have different rigidity characteristics. Rigid portions ensure structural stability while flexible portions accommodate thermal expansion, preventing warpage and maintaining reliability under thermal cycling conditions
3Ease of manufacture
If a uniform rigidity structure is used for simplicity, then manufacturing complexity is reduced, but stress distribution becomes uneven leading to cracks
Solution Approach 1:
Rather than using uniform rigidity throughout, the frame incorporates local quality variations with flexible portions positioned strategically to improve stress distribution. This localized approach maintains manufacturing feasibility while significantly enhancing stress distribution and preventing cracks
Data Source
AI summary
An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having a component disposition region defined by an inner wall of the frame surrounding the electronic component, and an encapsulant filling at least a portion of the component disposition region. A portion of the inner wall of the frame forms a protrusion protruding toward the electronic component.