Package-in-Package IC Mold with Segmented Cavities
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Solution Overview
Problem
Current integrated circuit package technologies face challenges in reducing package dimensions, cost, and improving yield while increasing functionality, particularly in consumer electronics where space is limited and cost reduction is critical.
Innovation Solution
The integrated circuit package-in-package system involves forming an external interconnect with upper and lower portions, mounting an active device over a packaged device, connecting them, and molding the entire structure to create a compact, cost-effective package with improved yield and functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If mature package technologies with lead frames are used to pack more integrated circuits into a single package, then the quantity of integrated circuits increases, but the overall package yield becomes a concern
Solution Approach 1:
The patent divides the package into multiple independent cavities within a single mold, where each cavity can independently contain and protect integrated circuits. This segmentation allows more circuits to be packaged while maintaining yield because defects in one cavity do not propagate to other cavities, and each cavity can be independently tested and replaced if necessary.
Solution Approach 2:
The patent implements a package-in-package structure where multiple integrated circuits are nested within a single molded package containing multiple cavities. Each cavity acts as a nested container for individual circuits, allowing high-density packaging while maintaining the ability to independently manage and replace individual units without affecting the entire package yield.
2Adaptability or versatility
If integrated circuits are stacked into a single package to increase functionality, then the function count increases, but the package height and physical space reduction requirements are not fully met
Solution Approach 1:
Instead of stacking circuits vertically in a single cavity (increasing height), the patent distributes multiple circuits across multiple cavities arranged in a planar array within the same package footprint. This dimensional redistribution allows high functionality to be achieved while maintaining low package height, as the circuits are arranged horizontally across multiple cavities rather than vertically in a stack.
3Ease of manufacture
If existing manufacturing processes are reused to reduce cost, then manufacturing cost decreases, but package dimensions are not reduced
Solution Approach 1:
The patent designs a single mold structure that performs multiple functions: it creates multiple cavities for packaging multiple integrated circuits, provides individual protection for each circuit, enables independent testing and replacement, and maintains compatibility with existing molding processes. This multi-functionality allows the use of mature low-cost molding technology while achieving reduced package dimensions through efficient space utilization across multiple cavities.
Data Source
AI summary
An integrated circuit package-in-package system is provided including forming an external interconnect having an upper portion and a lower portion; forming a packaged device; mounting an active device over the packaged device; connecting the active device to the packaged device and the upper portion; and molding the packaged device, the active device, and the upper portion.