Thermal Management for Package Inductors Using Conductive Interlayers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As computing devices miniaturize, integrated voltage regulators face increased current demands, leading to significant heating issues in inductors, which can exceed temperature limits, limiting maximum current and performance.
Innovation Solution
The implementation of thermally conductive materials in contact with inductors between the device package and system board to effectively transfer heat, allowing higher currents and improved reliability by managing thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the current through the inductor is increased to improve power delivery, then the power delivery capability is improved, but the temperature of the inductor rises above safe operating limits
Solution Approach 1:
A thermally conductive material is introduced as an intermediary between the inductor and the system board. This material has higher thermal conductivity than conventional materials, acting as a thermal mediator to efficiently transfer heat from the inductor to the system board, thereby managing inductor temperature while allowing higher current operation
Solution Approach 2:
Heat is extracted from the inductor by conducting it away through the thermally conductive material to the system board. This extraction of thermal energy allows the inductor to operate at higher currents without accumulating excessive heat, resolving the temperature limitation
2Area of stationary object
If the inductor area is reduced to increase integration density, then the area occupied by the inductor is reduced, but the power dissipation density increases leading to higher temperatures
Solution Approach 1:
The thermal conductivity parameter of the material between the inductor and system board is changed from conventional low conductivity material to a high conductivity material. This parameter change enables more efficient heat removal from the reduced-area inductor, allowing high integration density without sacrificing thermal management
3Device complexity
If conventional thermal materials are used between the inductor and system board, then the package structure is simple, but the inductor temperature rises above reliability limits
Solution Approach 1:
The thermal conductivity parameter of the interface material is changed from conventional values to enhanced values. This material parameter improvement enables effective thermal management and maintains reliability without requiring complex structural modifications to the package
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables better performance and reliability by effectively managing heat from inductors, preventing overheating and maintaining temperatures within safe limits, thus allowing higher current delivery to integrated circuit devices.
Implementation Method 1
highly thermally conductive material between the second substrate surface and a printed circuit board surface, the highly thermally conductive material contacting the one or more inductors
Data Source
AI summary
An apparatus is provided which comprises: one or more pads comprising metal on a first substrate surface, the one or more pads to couple with contacts of an integrated circuit die, one or more substrate layers comprising dielectric material, one or more conductive contacts on a second substrate surface, opposite the first substrate surface, the one or more conductive contacts to couple with contacts of a printed circuit board, one or more inductors on the one or more substrate layers, the one or more inductors coupled with the one or more conductive contacts and the one or more pads, and highly thermally conductive material between the second substrate surface and a printed circuit board surface, the highly thermally conductive material contacting the one or more inductors. Other embodiments are also disclosed and claimed.