IC Package Lid Cooling Passages for Dense Heat Dissipation

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Solution Overview

Problem

The challenge in the semiconductor industry is to effectively manage heat dissipation in densely integrated electronic components, as smaller packaging techniques are needed to accommodate increasing integration densities without compromising performance.

Innovation Solution

A package structure is developed with a lid structure that includes cooling passages for heat dissipation, utilizing a heat dissipation structure with embedded micro-channels formed by removing strips from a bulk substrate, which is attached to integrated circuit dies to allow cooling fluid flow for efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If smaller packaging techniques are used to accommodate increasing integration densities, then more components can be integrated into a given area, but heat dissipation becomes more difficult and performance may be compromised

Engineering Contradiction:

Improveintegration densityVSAvoidheat dissipation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The lid structure is segmented into multiple cooling passages that are distributed across the lid, allowing heat to be dissipated from multiple locations simultaneously. This segmentation of the cooling system enables effective heat management in densely integrated packages where a single cooling point would be insufficient.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cooling passages extend through the thickness of the lid structure, utilizing the vertical dimension for heat dissipation. This three-dimensional cooling approach allows heat to be removed from multiple levels of the densely integrated components, addressing the thermal challenges of high integration density.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If cooling passages are added to the lid structure for heat dissipation, then thermal management improves, but device complexity increases

Engineering Contradiction:

Improveheat dissipationVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The lid structure serves multiple functions: it provides mechanical protection for the integrated circuit devices and simultaneously acts as a heat sink with integrated cooling passages. This multi-functionality reduces the need for separate cooling components, thereby limiting the increase in device complexity while still achieving effective heat dissipation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The cooling passages are merged into the lid structure itself rather than being separate components. The lid is formed as a single piece with cooling passages integrated throughout, combining the protective enclosure function with the thermal management function in one unified structure.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If cooling passages are formed by removing strips from bulk substrate, then heat dissipation efficiency improves, but manufacturing precision requirements increase

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstrip removal precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

Strips are removed from the bulk substrate in advance during the manufacturing process to form cooling passages before the lid is assembled to the integrated circuit devices. This preliminary formation of cooling passages allows for controlled manufacturing while ensuring proper alignment and fit when the lid is later attached to the package.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the performance of integrated circuit packages by effectively dissipating heat generated by the integrated circuit devices, improving thermal management and reducing the risk of leakage through sufficient space for a sealant.

Implementation Method 1

cooling passages for allowing cooling fluid to flow through for dissipating heat generated by the integrated circuit devices

Methodology Applied

Scientific EffectHeat dissipation: Convection

Implementation Method 2

heat dissipation structure with embedded micro-channels formed by removing strips from a bulk substrate, which is attached to integrated circuit dies to allow cooling fluid flow for efficient heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260076196A1Package with Heat Dissipation Structure and Method for Forming the Same

Publication Date: 2026.03.12 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

In an embodiment, a package includes an encapsulant laterally surrounding a first integrated circuit device and a second integrated circuit device, wherein the first integrated circuit device includes a die and a heat dissipation structure over the die; a sealant disposed over the heat dissipation structure; an adhesive disposed over the second integrated circuit device; and a lid disposed over the sealant and the adhesive, wherein the lid includes a first cooling passage and a second cooling passage, the first cooling passage including an opening at a bottom of the lid and aligned to the heat dissipation structure, the second cooling passage including channels aligned to the second integrated circuit device and being distant from the bottom of the lid.