Semiconductor Package Lid Spacers for TIM and Adhesive Control
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently integrating and connecting multiple semiconductor dies on a single interposer structure, leading to issues with thermal management and reliability due to uneven thermal interface material distribution and adhesive bleeding.
Innovation Solution
The use of spacer structures, such as conductive or polymeric spacers, is introduced between the circuit substrate and the lid structure to control the distance and distribution of thermal interface materials and adhesives, ensuring uniform attachment and preventing delamination and bleeding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor dies are integrated on a single interposer structure, then device functionality and connectivity are improved, but thermal management becomes difficult due to uneven thermal interface material distribution
Solution Approach 1:
The patent introduces spacer structures at specific locations between the interposer and lid to create localized support points. These spacers ensure uniform thermal interface material distribution in critical areas, addressing thermal management issues locally without requiring complete redesign of the entire package structure.
2Stability of the object's composition
If adhesive material is used to attach the lid structure to the circuit substrate, then structural stability is improved, but adhesive bleeding occurs compromising reliability
Solution Approach 1:
The spacer structures are positioned between the lid and circuit substrate before the adhesive attachment process. These pre-positioned spacers act as barriers that prevent adhesive from migrating to unwanted areas, thereby preventing adhesive bleeding while maintaining structural stability during the attachment process.
Solution Approach 2:
The spacer structures serve as intermediary elements between the adhesive material and the circuit substrate. They control adhesive flow and distribution, ensuring that the adhesive remains in appropriate areas for bonding while preventing it from bleeding into areas that would compromise device reliability.
3Reliability
If spacer structures are introduced to control thermal interface material distribution, then thermal management is improved, but device complexity increases
Solution Approach 1:
Rather than attempting to control thermal interface material distribution across the entire lid surface, the patent segments the approach by using discrete spacer structures at key locations. This segmented approach achieves effective thermal management while adding minimal complexity compared to a completely uniform support structure.
Data Source
AI summary
A package structure includes a circuit substrate, a semiconductor package, a lid structure and a plurality of first spacer structures. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package, wherein the lid structure is attached to the circuit substrate through an adhesive material. The plurality of first spacer structures is surrounding the semiconductor package, wherein the first spacer structures are sandwiched between the lid structure and the circuit substrate, and includes a top portion in contact with the lid structure and a bottom portion in contact with the circuit substrate.