Electronic Component Package with Metal Layer Heat Dissipation
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Solution Overview
Problem
Wafer level packages face challenges in effectively managing excessive heat generation and electromagnetic interference due to the high functionality of electronic components, which affects the heat radiation characteristics and operation of electronic devices.
Innovation Solution
Incorporating a frame with metal layers into the encapsulation region of the electronic component package, which helps in diffusing heat and shielding electromagnetic waves, thereby improving heat radiation and reducing electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a wafer level package uses general encapsulating material to simply encapsulate an electronic component, then the manufacturing process is simple and cost-effective, but excessive heat generation and electromagnetic interference cannot be effectively controlled
Solution Approach 1:
The patent uses a dual-material encapsulation structure combining a first encapsulating material (epoxy resin) and a second encapsulating material (metal layer). The metal layer is specifically positioned to provide electromagnetic shielding and heat dissipation functions, while the epoxy resin provides structural encapsulation. This composite approach allows simultaneous achievement of manufacturing simplicity and effective control of heat and electromagnetic interference.
2Adaptability or versatility
If high-functionality electronic components are used to increase pin count and functionality, then device capability is improved, but heat generation and electromagnetic interference increase
Solution Approach 1:
The patent introduces a metal layer as an intermediary element between the electronic component and the external environment. This metal layer acts as a mediator that intercepts and manages the harmful effects (heat and electromagnetic interference) generated by high-functionality components, allowing the components to operate at full capability without being constrained by thermal and electromagnetic issues.
3Volume of moving object
If the package size is reduced to meet miniaturization requirements, then device compactness is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent employs a thin metal layer within the encapsulation structure that provides disproportionate thermal management benefits relative to its thickness. This thin film approach allows effective heat dissipation and electromagnetic shielding without significantly increasing the package volume, thus maintaining miniaturization while improving thermal capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively controls heat generation and electromagnetic interference, enhancing the heat radiation characteristics and operational reliability of electronic component packages.
Implementation Method 1
Incorporating a frame with metal layers into the encapsulation region of the electronic component package, which helps in diffusing heat
Implementation Method 2
Incorporating a frame with metal layers into the encapsulation region of the electronic component package, which helps in diffusing heat and shielding electromagnetic waves
Data Source
AI summary
An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.