Package Module with Metal Shielding Layers for EMI and Thermal Management
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Solution Overview
Problem
Existing package modules face challenges in miniaturization and effective electromagnetic interference shielding while incorporating multiple chips and components, with limited heat dissipation and spatial constraints.
Innovation Solution
A package module design featuring a core structure with penetrating and recessed portions, metal layers for shielding, and an insulating material for heat dissipation, allowing for compact integration of multiple chips and components while reducing electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple chips and components are integrated in a single package, then functionality and performance are improved, but electromagnetic interference between blocks increases
Solution Approach 1:
The package structure is divided into multiple isolated blocks (first block, second block, third block) separated by insulating materials and metal shielding layers. This segmentation allows different functional components to be integrated while preventing electromagnetic interference between them through physical and electromagnetic isolation.
Solution Approach 2:
Metal layers (first metal layer, second metal layer, third metal layer) are introduced as intermediary shielding structures between different functional blocks. These metal layers act as electromagnetic barriers that block interference while allowing thermal conduction, thus protecting sensitive components without compromising heat dissipation.
2Volume of moving object
If package size is reduced for miniaturization, then portability and integration density are improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent utilizes three-dimensional vertical stacking of multiple blocks and layers within a compact footprint. By arranging components in multiple levels (first block, second block, third block stacked vertically) rather than spreading them horizontally, the design achieves miniaturization while maintaining adequate thermal pathways through the vertical structure.
Solution Approach 2:
The metal shielding layers serve dual functions: they provide electromagnetic shielding between blocks and simultaneously act as heat dissipation pathways. The thermal conduction properties of these metal layers enable heat from high-power components to be conducted away through the same structures that provide electromagnetic protection, eliminating the need for separate thermal management systems.
3Object-affected harmful factors
If metal shielding layers are added to prevent electromagnetic interference, then electromagnetic protection is improved, but device complexity increases
Solution Approach 1:
The metal layers are designed to perform multiple functions simultaneously: electromagnetic shielding, thermal conduction, and structural support. By making these layers multi-functional, the patent reduces the need for additional separate components, thus limiting the increase in overall device complexity despite adding shielding capabilities.
Solution Approach 2:
The patent merges the electromagnetic shielding function with the thermal management function by using the same metal layers for both purposes. Additionally, the insulating materials serve both as electrical isolation barriers and as part of the structural matrix holding components in place, reducing the total number of discrete elements needed.
4Object-affected harmful factors
If insulating materials are used to isolate blocks, then electromagnetic interference is reduced, but heat dissipation pathways are blocked
Solution Approach 1:
Metal layers are positioned as intermediary structures between insulating material layers, creating a thermal conduction pathway through the electromagnetic isolation barriers. The metal layers bridge the thermal gap created by insulating materials, allowing heat to conduct through the shielding structure while maintaining electromagnetic isolation between blocks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves miniaturization, effective electromagnetic interference shielding, and improved heat dissipation, enabling efficient integration of multiple chips and components in a compact form.
Implementation Method 1
a structure which may isolate blocks from each other may be required, and also a structure which may effectively dissipate heat generated by chips or components may be required
Implementation Method 2
an insulating material covering at least a portion of each of the frame and the electronic component and filling at least a portion of the penetrating portion
Data Source
AI summary
A package module includes a core structure including a frame having a penetrating portion, an electronic component disposed in the penetrating portion, and an insulating material covering at least a portion of each of the frame and the electronic component and filling at least a portion of the penetrating portion. The core structure further has a recessed portion in which a stopper layer is disposed on a bottom surface of the recessed portion. A semiconductor chip has a connection pad and is disposed in the recessed portion such that an inactive surface faces the stopper layer. An encapsulant covers at least a portion of each of the core structure and the semiconductor chip, and fills at least a portion of the recessed portion. An interconnect structure is disposed on the core structure and an active surface of the semiconductor chip, and includes a redistribution layer.