Package-on-Package Structure Amorphous Layer Impurity Diffusion
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Solution Overview
Problem
Ensuring the reliability of integrated fan-out packages, which face challenges due to the need for compactness and efficient integration of smaller electronic components, is a significant issue in the semiconductor industry.
Innovation Solution
The manufacturing process involves forming a package-on-package (PoP) structure using a carrier with a de-bonding layer, seed material layers, conductive material deposition, and a hybrid etching process to remove the de-bonding and adhesive layers, ensuring the reliability of the conductive structures and dies by preventing impurity diffusion and enhancing adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If integrated fan-out packages are made more compact to integrate smaller electronic components, then integration density and compactness are improved, but reliability of the package deteriorates
Solution Approach 1:
The package structure is segmented into multiple functional layers including carrier, de-bonding layer, adhesive layer, die, encapsulant, and underfill. This segmentation allows each layer to perform its specific function optimally while maintaining overall package integrity and reliability despite compact dimensions.
Solution Approach 2:
The de-bonding layer is formed on the carrier before die attachment, and the adhesive layer is applied beforehand. These preliminary actions ensure proper bonding and structural integrity are established before final assembly, maintaining reliability in the compact package structure.
2Ease of operation
If de-bonding and adhesive layers are removed to expose the die, then access to the die is improved, but impurity diffusion to the die occurs
Solution Approach 1:
An amorphous layer is introduced as an intermediary between the semiconductor substrate and the external environment. This layer acts as a protective barrier that prevents impurity diffusion while allowing the die to be accessible for bonding and electrical connection operations.
Solution Approach 2:
The amorphous layer is formed on the semiconductor substrate before final package assembly and die exposure. This beforehand protection ensures that when layers are removed for die access, the substrate is already protected against impurity diffusion.
3Ease of operation
If carrier and de-bonding layers are removed early in the process, then die access is improved, but manufacturing complexity increases
Solution Approach 1:
The de-bonding layer is formed on the carrier in advance, allowing the carrier to be removed after die attachment without requiring early removal of bonding layers. This preliminary preparation simplifies the overall manufacturing sequence while maintaining die accessibility.
Solution Approach 2:
The carrier is removed after die attachment, extracting only the necessary supporting structure while leaving the functional package components intact. This selective removal simplifies the final package structure without compromising manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and performance of the PoP structure by preventing impurity diffusion and ensuring strong adhesion, thereby improving the yield and reducing costs in semiconductor packaging.
Implementation Method 1
a hybrid etching process to remove the de-bonding and adhesive layers
Implementation Method 2
an amorphous layer located on the rear surface... ensuring the reliability of the conductive structures and dies by preventing impurity diffusion
Implementation Method 3
A die is attached on the de-bonding layer through an adhesive layer
Data Source
AI summary
A package-on-package (PoP) structure includes a first package and a second package stacked on the first package. The first package includes a die, a plurality of conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The die includes an amorphous layer located on the rear surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The redistribution structure is on the active surface of the die and is electrically connected to the conductive structures and the die.