Shared Package Substrate Power Network for Noise Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing packages face challenges in providing efficient power distribution and noise isolation between integrated devices, which affects overall performance.
Innovation Solution
A substrate with multiple metal layers and interconnects that form a shared power distribution network, incorporating inductors to isolate noise by extending electrical paths through multiple layers, creating additional inductance to reduce noise transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional power distribution network is used, then power delivery is provided, but noise transfer occurs between integrated devices
Solution Approach 1:
The patent converts the harmful noise transfer into a beneficial isolation mechanism by intentionally introducing inductance elements into the power distribution network. These inductors block high-frequency noise while maintaining DC power delivery, effectively converting the problematic noise propagation path into a noise-filtering path that improves overall system performance
Solution Approach 2:
The patent introduces inductor elements as intermediary components between integrated devices in the power distribution network. These inductors act as mediators that allow DC power to pass through while blocking AC noise signals, thereby isolating noise between devices without preventing essential power delivery
2Object-affected harmful factors
If additional inductance is added to isolate noise, then noise transfer is reduced, but device complexity increases
Solution Approach 1:
The patent merges the inductor elements directly into the existing power distribution network traces and interconnect structures. Instead of adding separate discrete inductor components, the inductance is integrated into the PCB traces and metal layers, combining the power delivery function with the noise isolation function in a single unified structure
Solution Approach 2:
The patent makes the power distribution network multi-functional by enabling it to simultaneously perform power delivery and noise isolation functions. The same traces and interconnects that carry power also provide inductive noise filtering, eliminating the need for separate dedicated isolation components and reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves power delivery and reduces noise transfer between integrated devices, enhancing the overall performance of the package.
Implementation Method 1
The first plurality of interconnects are configured to operate as an inductor configured to be electrically coupled to power
Data Source
AI summary
A device comprising a substrate, a first integrated device coupled to a first surface of the substrate, a second integrated device coupled to the first surface of the substrate, a first passive device coupled to a second surface of the substrate and a second passive device coupled to the second surface of the substrate. The substrate comprises at least one dielectric layer and a plurality of interconnects. The plurality of interconnects include a power interconnect. The power interconnect is configured to be electrically coupled to power. The first integrated device, the first passive device, the second integrated device and the second passive device are configured to be electrically coupled to the power interconnect through a first plurality of interconnects from the plurality of interconnects. The first plurality of interconnects are configured to operate as an inductor, where the first plurality of interconnects include a via interconnect.