Package Power Regulating Module With Integrated RDL Decoupling
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Solution Overview
Problem
The power path in existing electronic component packages is relatively long, leading to reduced power efficiency and stability due to the arrangement of decoupling capacitors outside the fan-out redistribution layer, which increases power loss and resistance.
Innovation Solution
A package structure with a power regulating module disposed adjacent to the processing module, incorporating a decoupling element to vertically transmit power signals directly to the processing element, reducing the power path length and integrating decoupling and conductive elements to minimize size and improve efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the decoupling capacitor is mounted outside of the fan-out RDL, then the package structure allows separate manufacturing processes, but the power path becomes relatively long which reduces power efficiency and power supply stability
Solution Approach 1:
The patent merges the decoupling capacitor with the fan-out RDL by forming the capacitor between conductive layers of the RDL structure itself. This integration eliminates the need for separate capacitor mounting while maintaining the benefit of modular manufacturing, as the capacitor is created during the RDL fabrication process rather than as a separate component assembly step.
Solution Approach 2:
The patent transitions from a planar arrangement where capacitors are mounted on the surface to a vertical arrangement where capacitors are formed between conductive layers within the RDL structure. This dimensional change allows the capacitor to be positioned much closer to the power consumption elements, significantly shortening the power path while maintaining manufacturing flexibility.
2Ease of operation
If the decoupling capacitor is mounted outside of the fan-out RDL, then the package structure is simpler to assemble, but the power path length increases which reduces power supply stability
Solution Approach 1:
The decoupling capacitor is merged with the fan-out RDL structure, eliminating separate assembly steps for capacitor mounting while maintaining manufacturing simplicity. The capacitor is formed as an integral part of the RDL during the same fabrication process, preserving assembly ease while dramatically improving power supply stability through reduced power path length.
Solution Approach 2:
The RDL structure itself provides the decoupling function by forming capacitor elements within its conductive layers. This self-service approach eliminates the need for external capacitor components and their associated assembly operations, while the resulting short power paths inherently improve power supply stability.
3Loss of energy
If the power path is shortened by integrating decoupling elements, then power efficiency improves, but the device complexity increases
Solution Approach 1:
The fan-out RDL structure is designed to serve multiple functions simultaneously: power distribution, signal routing, and decoupling capacitance. By making the RDL multi-functional, the patent achieves short power paths for improved efficiency without adding separate decoupling components that would increase structural complexity.
Solution Approach 2:
The patent combines multiple functions (power distribution and decoupling) into a single integrated structure. The same conductive layers that distribute power also form the decoupling capacitors, eliminating the need for additional components and maintaining relatively simple device architecture while achieving improved power efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces power loss, increases power efficiency, and enhances power supply stability by shortening the power path and integrating decoupling and conductive elements, while allowing separate manufacturing processes for different node components.
Implementation Method 1
The decoupling element is configured to decouple a first noise from a first power signal and transmit the first power signal to the first side of the processing element
Data Source
AI summary
A package structure is provided. The package structure includes a processing module, a storage module, and a power regulating module. The processing module includes a processing element having a first side configured to receive power. The power regulating module is disposed adjacent to the processing module. The power regulating module includes a first portion and a second portion. The first portion is configured to decouple a first noise from a first power signal and transmit the first power signal to the first side of the processing element. The second portion is configured to transmit a second power signal to the storage module.