Semiconductor Package Reinforcement Structure for Warpage Control

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Solution Overview

Problem

Semiconductor packages face challenges due to thermal-mechanical stress, leading to warpage and crack formation, particularly in three-dimensional devices like 3DICs and SoICs, which can cause mechanical distortions and dislocations.

Innovation Solution

Incorporation of reinforcement structures within the package substrate, made of materials with higher Young's modulus, such as silicon or silicon nitride, to provide mechanical support and reduce warping, thereby improving co-planarity and solder connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If three-dimensional devices (3DICs, SoICs) are used to improve integration density and bandwidth, then integration density and performance are improved, but mechanical stress and crack formation increase

Engineering Contradiction:

Improveintegration densityVSAvoidmechanical stability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The package substrate is divided into multiple regions with different mechanical properties. Reinforcement structures are selectively placed in specific areas to provide localized mechanical support where needed, while other areas maintain flexibility for stress relief

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The package substrate combines materials with different mechanical properties - a base substrate material combined with reinforcement structures made of materials having higher Young's modulus. This composite structure provides both the flexibility needed for stress accommodation and the rigidity needed for mechanical stability

Inventive Principle:

Principle #40Composite materials

2Stability of the object's composition

If reinforcement structures with higher Young's modulus are added to reduce warpage, then mechanical stability is improved, but device complexity increases

Engineering Contradiction:

Improvemechanical stabilityVSAvoidpackage structure complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

Reinforcement structures are strategically positioned in specific regions of the package substrate where mechanical support is most needed, such as beneath solder balls or in high-stress areas. This localized approach provides mechanical stability without adding reinforcement throughout the entire substrate

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

Rather than reinforcing the entire substrate uniformly, only critical areas are strengthened with reinforcement structures. This partial action approach achieves the necessary mechanical stability while minimizing the added complexity and material

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The reinforcement structures enhance mechanical stability, reducing warpage and improving solder connections, ensuring reliable electrical interconnects and preventing crack formation in semiconductor packages.

Implementation Method 1

Methodology Applied

Scientific EffectYoung's modulus:

Data Source

PatentUS20250357352A1Semiconductor package including reinforcement structure and methods of forming the same

Publication Date: 2025.11.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package includes a package substrate a package substrate including: a substrate core; an upper redistribution layer disposed on a first side of the substrate core; and a lower redistribution layer disposed on an opposing second side of the substrate core; a semiconductor device vertically stacked on and electrically connected to the package substrate; and an upper reinforcement layer embedded in the upper redistribution layer between the semiconductor device and the substrate core, the upper reinforcement layer having a Young's modulus that is higher than a Young's modulus of the upper redistribution layer.