Resin Molded Package Removal via Third Outer Surface Pushing
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Solution Overview
Problem
Existing methods for manufacturing light emitting devices often result in damage to the housing when removing it from the lead frame due to applied bending force and shock.
Innovation Solution
A method involving a plate-like lead frame with pairs of supporting leads and resin molded packages, where the packages have specific recesses for the leads to fit into, allowing for gentle sliding removal from the lead frame, reducing the risk of damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the housing is removed from the lead frame by applying bending force, then the housing can be detached from the lead frame, but the housing may be damaged due to applied bending force and shock
Solution Approach 1:
A release hole is formed in the resin molded body (housing) to reduce bending moment during removal. This release hole acts as an intermediary structural feature that allows the housing to be detached from the lead frame while significantly reducing the bending force and shock applied to the housing, thereby preventing damage.
2Stability of the object's composition
If the packages are securely engaged with the lead frame, then the packages remain fixed during handling, but the packages may be unintentionally removed from the lead frame
Solution Approach 1:
The resin molded body has different structural properties in different regions: the main body provides secure engagement with the lead frame through supporting leads, while the release hole creates a localized area of reduced structural integrity that allows controlled removal. This local quality differentiation enables both stable fixation during handling and intentional removal when needed.
Data Source
AI summary
A method of manufacturing a light emitting device includes: providing a light emitting device set that includes a lead frame being plate-like and including pairs of supporting leads each of which pairs consists of a first supporting lead and a second supporting lead, packages respectively supported by the pairs of supporting leads, and light emitting elements respectively mounted on the packages; and removing the packages from the lead frame. The packages each include a resin molded body, the resin molded body includes a first recess open at the first and third outer surfaces, and a second recess open at the second and third outer surfaces. The first supporting lead and the second supporting lead respectively fit into the first recess and the second recess. In the removing step, the packages are each removed from the lead frame by the third outer surface being pushed.