Semiconductor Package Ring Structure for Lower Thermal Resistance
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Solution Overview
Problem
The complexity of semiconductor integrated circuit (IC) processing and manufacturing is increased by the scaling-down process, which results in high power dissipation and inefficient thermal management due to multiple thermal interfaces and lid-based structures, leading to high thermal resistance and increased manufacturing costs.
Innovation Solution
Incorporating backside metallization on both the chip-on-wafer (CoW) and heat sink, and using a ring structure instead of a lid, with a metal thermal interface material (TIM) directly bonded to the heat sink, reduces the number of thermal interfaces and enhances thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a lid-based structure is used for thermal management, then the package structure is complete and protected, but the number of thermal interfaces increases and thermal resistance increases
Solution Approach 1:
The patent removes the lid component from the package structure entirely, replacing it with an exposed top surface of the semiconductor die. This extraction eliminates the additional thermal interface that would be created by the lid, directly reducing thermal resistance while maintaining package integrity through alternative means such as substrate design and thermal management layers.
2Device complexity
If multiple thermal interfaces are used in the lid-based structure, then the package is well-structured, but heat dissipation efficiency decreases
Solution Approach 1:
The patent merges the thermal management function directly into the substrate and die assembly by eliminating separate thermal interface components. The substrate serves dual functions as both structural support and thermal conduction path, while the exposed die top surface allows direct thermal coupling with heat sinks or thermal management devices, reducing the number of interfaces and improving heat dissipation efficiency.
3Temperature
If backside metallization is incorporated on CoW and heat sink, then thermal pathway is simplified and thermal resistance decreases, but manufacturing process complexity increases
Solution Approach 1:
The patent applies backside metallization to the semiconductor die during the semiconductor fabrication process itself, before packaging. This preliminary action integrates the thermal conduction layer into the die structure, allowing subsequent packaging steps to focus on assembly rather than additional metallization processes, thereby reducing overall manufacturing complexity despite the added thermal management capability.
4Loss of energy
If metal TIM is directly bonded to the heat sink, then thermal interface efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent changes the material parameters of the thermal interface by using metal-to-metal bonding between the backside metallization of the die and the heat sink, replacing traditional organic or ceramic TIM materials. This parameter change enables direct bonding with potentially lower precision requirements due to the ductility and bonding characteristics of metals, while achieving superior thermal interface efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach decreases thermal resistance by at least 50% and improves heat dissipation efficiency, simplifying the thermal pathway and reducing manufacturing costs by eliminating the need for a lid-based structure.
Implementation Method 1
forming a thermal interface material (TIM) layer over the package structure; attaching a heat sink structure to the TIM layer
Implementation Method 2
attaching a heat sink structure to the TIM layer and the ring structure, in which the heat sink comprises a cover portion and a plurality of heat dissipating fins
Implementation Method 3
a plurality of heat dissipating fins upwardly extending from a top surface of the cover portion
Data Source
AI summary
The present disclosure provides a method. In some embodiments, the method includes providing a substrate; bonding a package structure to the substrate; attaching a ring structure on the substrate and surrounding the package structure; forming a thermal interface material (TIM) layer over the package structure; attaching a heat sink structure to the TIM layer and the ring structure.