Electronic Package Routing Structure Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face inefficiencies in heat dissipation due to the need for heat to pass through encapsulants before reaching the circuit board, resulting in poor heat dissipation effects.
Innovation Solution
The electronic package incorporates a routing structure with heat dissipation pads and a heat dissipation member bonded to a carrier structure, allowing for direct heat dissipation from electronic modules and package modules to the external environment through conductive elements and a heat dissipation pad, reducing the heat dissipation path and improving heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation path is reduced by removing encapsulants, then heat dissipation efficiency is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent transitions from conventional planar heat dissipation through encapsulants to three-dimensional vertical heat dissipation by stacking package modules directly on the circuit board. This dimensional change allows heat to be conducted directly to the board without passing through horizontal encapsulant layers, significantly improving heat dissipation efficiency while maintaining structural integrity through vertical integration.
Solution Approach 2:
The patent extracts and removes the encapsulant layer that traditionally covered the circuit board in conventional packages. By taking out this heat-insulating layer, the invention enables direct thermal contact between the package module and the circuit board, creating an efficient heat dissipation path while reducing the number of intermediate layers that would otherwise complicate the structure.
2Temperature
If encapsulants are removed for direct heat dissipation, then heat dissipation efficiency is improved, but protection and insulation functions are compromised
Solution Approach 1:
The patent relocates the protective and insulating functions from horizontal encapsulant layers to vertical barrier structures. By positioning insulating layers and protective structures at the interfaces between package modules and the circuit board, the design maintains protection and insulation functions while enabling direct thermal contact through the vertical heat dissipation path.
Solution Approach 2:
The patent applies protection and insulation properties locally at critical interfaces rather than through comprehensive encapsulation. Insulating layers and protective structures are strategically placed only where needed - at the bonding interfaces between conductive elements and the circuit board - providing sufficient protection and insulation while leaving the rest of the structure open for efficient heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables faster and more effective heat dissipation of electronic modules and package modules by utilizing heat dissipation pads and members, enhancing thermal management in semiconductor devices.
Implementation Method 1
a heat dissipation member disposed on the at least one heat dissipation pad and bonded to the carrier structure, wherein the heat dissipation member covers a part of a surface of the routing structure
Data Source
AI summary
A method of manufacturing an electronic package is provided, in which a package module including a routing structure is stacked on a carrier structure via a plurality of conductive elements, a heat dissipation member covers a part of a surface of the routing structure, and an electronic module is disposed on another part of the surface of the routing structure, so that the routing structure is formed with at least one heat dissipation pad bonded to the heat dissipation member, such that the heat energy of the electronic module and the package module can be dissipated via the heat dissipation pad and the heat dissipation member.