Semiconductor Package Seal Ring Layout for Seed Layer Uniformity
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Solution Overview
Problem
The semiconductor industry faces challenges in manufacturing smaller semiconductor devices with improved integration density and reduced package size, particularly in ensuring uniformity and step coverage of seed layers and insulating layers during the manufacturing process.
Innovation Solution
A seal ring structure is introduced in the interconnect and redistribution structures of semiconductor packages to improve step coverage and uniformity of seed layers by reducing the aspect ratio of openings between seal ring structures, and the redistribution layer has a large width to enhance landing process control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the minimum feature size is reduced to improve integration density, then more components can be integrated into a given area, but the manufacturing precision and uniformity of seed layers and insulating layers deteriorate
Solution Approach 1:
The patent introduces seal ring structures that segment the manufacturing field into controlled regions. These seal rings create discrete zones with controlled aspect ratios, allowing different deposition parameters to be optimized for different regions. This segmentation enables maintaining uniformity in critical areas while achieving high integration density overall.
Solution Approach 2:
The patent modifies geometric parameters by designing seal ring structures with specific width and spacing that control the aspect ratio of openings. By changing these parameters, the deposition uniformity and step coverage are improved without sacrificing integration density. The large width of redistribution layers is another parameter change that enhances landing precision.
2Area of stationary object
If the package size is reduced to meet smaller application requirements, then less area and height are utilized, but the manufacturing challenges and difficulty of maintaining layer uniformity increase
Solution Approach 1:
The patent applies local quality by introducing seal ring structures at specific locations within the package. These structures provide localized control over deposition parameters in critical areas, ensuring uniformity where needed most while allowing the overall package size to be minimized. The seal rings create locally optimized zones that address manufacturing challenges in compact geometries.
Solution Approach 2:
The patent uses seal ring structures that extend in dimensions other than the primary miniaturization direction. By adding these structural elements in the lateral dimension, the patent controls the aspect ratio and improves step coverage without significantly increasing the overall package footprint, thus maintaining compact size while improving manufacturability.
3Manufacturing precision
If the aspect ratio of openings between seal ring structures is reduced to improve step coverage, then seed layer uniformity improves, but the structural complexity increases
Solution Approach 1:
The seal ring structures are formed as preliminary features before seed layer deposition. By pre-establishing these geometric constraints, the patent ensures that subsequent deposition processes achieve uniform step coverage without requiring complex in-process adjustments. The preliminary seal ring structures guide the deposition to achieve the desired uniformity.
Solution Approach 2:
The patent achieves improved step coverage by changing the geometric parameters of the seal ring structures themselves rather than modifying the deposition process complexity. By optimizing the width, spacing, and pattern of seal rings, uniform step coverage is achieved through geometric control rather than process complexity.
Data Source
AI summary
A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.