Semiconductor Package Structure With Stiff Bonding Against Warpage
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Solution Overview
Problem
Semiconductor package structures experience warpage and cracking due to low rigidity, leading to potential damage of circuit layers and reduced yield.
Innovation Solution
Incorporation of a stiff bonding material between electronic devices within the package structure, along with underfills, to enhance structural rigidity and reduce warpage and cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a semiconductor package structure integrates an increasing number of electronic components to achieve improved electrical performance and additional functions, then the electrical performance and functions are improved, but the rigidity of the package structure decreases, leading to warpage and cracking
Solution Approach 1:
The patent introduces a stiff bonding material with higher modulus than traditional underfill materials to create a composite structure. This composite approach combines the flexibility of underfill materials with the rigidity of the stiff bonding material, allowing the package to integrate multiple electronic components while maintaining structural strength and resisting warpage and cracking
2Ease of manufacture
If the rigidity of the semiconductor package structure is low, then the package structure is more flexible and easier to manufacture, but cracks are formed at the top surface and extend into the interior, damaging circuit layers
Solution Approach 1:
The patent applies different materials with different mechanical properties to different regions of the package structure. The underfill materials provide flexibility in the spaces between electronic devices and the substrate, while the stiff bonding material provides crack resistance in the central gap region. This local differentiation of material properties allows the structure to be both easy to manufacture and highly reliable
3Device complexity
If traditional underfill materials are used without stiff bonding material, then the manufacturing process is simpler, but the package structure experiences warpage during thermal process and reduced yield
Solution Approach 1:
The patent segments the bonding material into two distinct components: underfill materials applied in spaces between electronic devices and the substrate, and a separate stiff bonding material applied in the central gap. This segmentation allows each material to perform its specific function optimally while maintaining a relatively simple manufacturing process through sequential application
Data Source
AI summary
A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device, a second electronic device, a first underfill, a second underfill and a stiff bonding material. The first electronic device and the second electronic device are disposed on the wiring structure, and are electrically connected to each other through the wiring structure. The first underfill is disposed in a first space between the first electronic device and the wiring structure. The second underfill is disposed in a second space between the second electronic device and the wiring structure. The stiff bonding material is disposed in a central gap between the first electronic device and the second electronic device. The stiff bonding material is different from the first underfill and the second underfill.