Multi-Substrate Package Structure for High-Frequency Signal Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Window ball grid array (WBGA) packages struggle to transmit high-frequency signals due to the limitations of the wire-bonding process used for electrical connections.
Innovation Solution
A package structure design that includes multiple substrates with patterned circuit layers and through holes, allowing for direct electrical connections between electronic components through extending portions of the circuit layers, facilitating high-frequency signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire-bonding process is used for electrical connection, then manufacturing cost is reduced, but high-frequency signal transmission capability is lost
Solution Approach 1:
The patent extracts the wire-bonding process from the electrical connection method and replaces it with direct patterned circuit layer connections. The extending portions of the patterned circuit layers eliminate the need for wire bonds, thereby removing the limitation on high-frequency signal transmission while maintaining cost-effectiveness through direct copper-to-copper or copper-to-pad connections.
Solution Approach 2:
The patent extends the patterned circuit layers beyond the substrate sidewalls into a third dimension, creating extending portions that can directly contact pads on electronic components. This dimensional extension enables direct electrical connection without wire bonds, solving the high-frequency signal transmission problem while keeping the manufacturing process simple and cost-effective.
2Ease of manufacture
If wire-bonding process is used for electrical connection, then manufacturing cost is reduced, but signal transmission performance deteriorates
Solution Approach 1:
The wire-bonding process is completely removed from the electrical connection methodology. Instead, the patterned circuit layers are extended to create direct contact paths, eliminating the intermediate wire bond step that limited signal transmission performance while maintaining manufacturing simplicity and cost-effectiveness.
Solution Approach 2:
The extending portions of the patterned circuit layers serve as intermediaries between the substrate and electronic component pads. These extending portions provide direct electrical connection paths that support high-frequency signal transmission, replacing the wire-bonding intermediary that caused signal degradation.
3Reliability
If patterned circuit layers are extended beyond substrate sidewalls, then high-frequency signal transmission is enabled, but device complexity increases
Solution Approach 1:
The patent merges the electrical connection function with the existing patterned circuit layers by extending them beyond the substrate sidewalls. This integration eliminates the need for separate wire-bonding processes or additional connection structures, enabling high-frequency signal transmission while actually simplifying the overall device structure and manufacturing process.
Solution Approach 2:
The patterned circuit layers serve multiple functions: they provide electrical connection within the substrate, extend beyond the substrate to connect with electronic components, and enable high-frequency signal transmission. This multi-functionality reduces the need for additional specialized structures, thereby reducing overall device complexity despite the extended geometry.
Data Source
AI summary
A package structure and a method of manufacturing a package structure are provided. The package structure includes a first substrate, a first electronic component, a second substrate and a second electronic component. The first electronic component is disposed over a first through hole of the first substrate. The first electronic component is electrically connected to a first patterned circuit layer of the first substrate through an extending portion of the first patterned circuit layer extending beyond a sidewall of the first through hole. The second electronic component is disposed over a second through hole of the second substrate. The second electronic component is electrically connected to a second patterned circuit layer of the second substrate through an inner extending portion of the second patterned circuit layer extending beyond a sidewall of the second through hole.