Package-Substrate Optical Circuit Module for Faster Data and Power
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic circuit modules have insufficient information transmission efficiency and power-supply efficiency, as described in Patent Document 1.
Innovation Solution
An electronic circuit module with a photoelectric conversion unit, a processor unit, and a power conversion unit mounted on a package substrate, where these units are connected only through conductor patterns on the substrate, bypassing the motherboard connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are connected through the motherboard, then the device structure is simple, but the information transmission efficiency and power-supply efficiency are insufficient
Solution Approach 1:
The patent divides the connection path into two separate paths: one through the motherboard for power supply and one through the package substrate for information transmission. This segmentation allows each path to be optimized independently, with the package substrate providing high-speed data transmission and the motherboard providing stable power delivery.
Solution Approach 2:
The package substrate acts as an intermediary component between the accelerator chip and the motherboard. It provides dedicated conductor patterns for both power supply and signal transmission, mediating the connection requirements and enabling efficient communication while maintaining structural simplicity through the motherboard interface.
2Ease of manufacture
If components are connected through the motherboard, then the device structure is simple, but the power-supply efficiency is insufficient
Solution Approach 1:
The patent separates power supply connections from signal connections, with power supplied through the motherboard and signals transmitted through the package substrate. This segmentation reduces electrical interference and allows for optimized power delivery paths with appropriate impedance control and power management.
Solution Approach 2:
The package substrate serves as an intermediary that receives power from the motherboard through dedicated power pads and distributes it to the accelerator chip through optimized power delivery networks, improving power-supply efficiency while maintaining the simple motherboard connection structure.
3Productivity
If components are connected only through the package substrate, then the information transmission efficiency improves, but the device complexity increases
Solution Approach 1:
The patent merges the power supply function and signal transmission function into a single package substrate component. The substrate simultaneously provides power delivery networks and signal transmission paths, consolidating multiple functions into one element and reducing overall system complexity despite the enhanced connection capabilities.
Solution Approach 2:
The package substrate is designed with multi-functionality, serving both as a power distribution network and as a signal transmission medium. This universal component handles both electrical power delivery and high-speed data communication, eliminating the need for separate connection structures and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves information transmission efficiency and power-supply efficiency by reducing transmission losses and delays, and enabling shorter power supply paths.
Implementation Method 1
a photoelectric conversion unit that performs conversion between an optical signal and an electric signal
Data Source
AI summary
An electronic circuit module is an electronic circuit module mounted on a motherboard having a power supply source. The electronic circuit module includes a photoelectric conversion unit which performs conversion between an optical signal and an electric signal, a processor unit which performs computational processing by using an electric signal, a power conversion unit which converts power from the power supply source and which supplies power to the photoelectric conversion unit and the processor unit, and a package substrate on which the photoelectric conversion unit, the processor unit, and the power conversion unit are mounted. The photoelectric conversion unit, the processor unit, and the power conversion unit are connected only through a conductor pattern formed on/in the package substrate.