Package Substrate Release Layer for Chemical Resistance
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Solution Overview
Problem
The existing methods for manufacturing package substrates for semiconductor devices face challenges such as weak chemical resistance of the adhesive layer, infiltration of desmear solutions, and reduced flexibility in design due to the use of carrier copper foil-attached ultrathin copper foils, leading to decreased adhesion strength and potential product failures.
Innovation Solution
A method involving a supporting substrate with a first insulating resin layer, a release layer comprising a silicon compound, and ultrathin copper foil, where the release layer provides enhanced adhesion and chemical resistance by preventing infiltration of desmear solutions and allowing for increased flexibility in design through reduced layer thickness and improved handling properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If an ultrathin adhesive layer is provided between the carrier copper foil and the ultrathin copper foil, then the structure is simplified and production efficiency is improved, but the chemical resistance becomes weak and chemical solutions can penetrate the adhesive layer
Solution Approach 1:
A release layer is introduced as an intermediary component between the carrier copper foil and the ultrathin copper foil. This release layer acts as a mediator that prevents chemical solutions from penetrating through the adhesive layer, thereby protecting the adhesive interface while maintaining the simplified structure and production efficiency benefits of the ultrathin adhesive layer configuration.
2Length of stationary object
If the adhesive layer thickness is reduced to several tens of nm, then the total sheet thickness is reduced and wiring density is improved, but the adhesion strength decreases and the layer becomes vulnerable to chemical solution infiltration
Solution Approach 1:
The release layer serves as a protective intermediary that shields the thin adhesive layer from chemical solution infiltration. This allows the adhesive layer to maintain its reduced thickness for improved wiring density and reduced total sheet thickness, while the release layer compensates for the reduced adhesion strength by preventing chemical degradation.
3Ease of operation
If carrier copper foil-attached ultrathin copper foil is used, then the handling properties are improved, but the design flexibility is reduced due to the fixed carrier structure
Solution Approach 1:
The structure is segmented into distinct functional layers: the carrier copper foil provides handling support, the release layer provides chemical protection and release functionality, and the ultrathin copper foil provides the conductive element. This segmentation allows each layer to be optimized for its specific function, maintaining ease of handling while enabling design flexibility through the independent optimization of the release layer and copper foil components.
4Manufacturing precision
If desmear treatment is performed using sodium permanganate solution, then the resin smears in hole interiors are removed, but the chemical solution penetrates the adhesive layer and causes adhesion strength decrease and potential corrosion
Solution Approach 1:
The release layer acts as a chemical barrier intermediary that prevents desmear solutions from penetrating the adhesive layer. This allows the desmear treatment to effectively remove resin smears from hole interiors while the release layer protects the adhesive interface from chemical solution infiltration, maintaining adhesion strength and preventing corrosion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances production efficiency and design flexibility by maintaining adhesion strength and preventing chemical solution infiltration, resulting in a package substrate with increased wiring density and reduced total sheet thickness.
Implementation Method 1
the release layer provides enhanced adhesion and chemical resistance by preventing infiltration of desmear solutions
Implementation Method 2
an ultrathin adhesive layer is often provided between (at the interface between) the carrier copper foil and the ultrathin copper foil
Implementation Method 3
the ultrathin copper foil is corroded by the chemical solution, which may cause product failure
Data Source
Figure 1~(1H)
Figure 2~(2C)
Figure 3
AI summary
A method for manufacturing a package substrate for mounting a semiconductor device, comprising a substrate forming step (a) of forming a supporting substrate for circuit formation comprising a first insulating resin layer, a release layer comprising at least a silicon compound, and ultrathin copper foil having a thickness of 1 µm to 5 µm, in this order; a first wiring conductor forming step (b) of forming a first wiring conductor on the ultrathin copper foil of the supporting substrate for circuit formation by pattern copper electroplating; a lamination step (c) of disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and heating and pressurizing the second insulating resin layer for lamination; a second wiring conductor forming step (d) of forming in the second insulating resin layer a non-through hole reaching the first wiring conductor and connecting an inner wall of the non-through hole by copper electroplating and/or electroless copper plating to form a second wiring conductor; a peeling step (e) of peeling the first insulating resin layer from the supporting substrate for circuit formation on which the first wiring conductor and the second wiring conductor are formed; and a removal step (f) of removing the release layer and/or the ultrathin copper foil.