Package Substrate Rigid Flexible Dielectric Layers
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Solution Overview
Problem
Conventional epoxy molding compound used in package substrates is rigid and fragile, leading to damage or cracks during the fabrication process, which hinders the development of high-density and miniature electronic devices.
Innovation Solution
A package substrate design incorporating a combination of rigid and flexible dielectric material layers with metal wiring, where the rigid layers are made from materials like epoxy molding compound or glass-fabric epoxy resin and the flexible layers from polyimide or polytetrafluoroethylene, enhancing durability and preventing damage during fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If epoxy molding compound is used as the dielectric material in package substrates, then fine-pitch wiring and slimmed substrate are achieved, but the substrate becomes rigid and fragile, leading to damage or cracks during fabrication
Solution Approach 1:
The patent applies composite materials by combining rigid dielectric layers (for structural support and fine-pitch wiring) with flexible dielectric layers (for durability and crack prevention). This multi-layer composite structure integrates the advantages of both rigid and flexible materials, resolving the contradiction between manufacturing precision and substrate reliability.
2Length of stationary object
If epoxy molding compound is used in package substrates, then slimmed substrate is achieved, but the substrate becomes fragile and subject to damage during fabrication process
Solution Approach 1:
The patent uses composite materials combining rigid and flexible dielectric layers to achieve both slimmed substrate and improved strength. The flexible layers provide toughness and damage resistance while the rigid layers maintain the slim profile and structural integrity.
Solution Approach 2:
The flexible dielectric layers are incorporated beforehand to provide cushioning and protection against damage during the fabrication process. This preventive measure addresses the fragility issue before damage can occur during manufacturing.
3Manufacturing precision
If rigid dielectric material is used, then fine-pitch wiring is enabled, but the substrate is fragile and cracks during fabrication
Solution Approach 1:
The patent employs composite materials where rigid dielectric layers enable fine-pitch wiring while flexible dielectric layers prevent damage and cracks. The combination allows both wiring precision and damage resistance to be achieved simultaneously.
Data Source
AI summary
This disclosure provides a package substrate which includes a rigid dielectric material layer, a first wiring layer having at least one first metal wire formed on the rigid dielectric material layer, and a first flexible dielectric material layer formed on the first wiring layer.