Semiconductor Package Surface Patterns for Die-Specific Parameter Reading
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Solution Overview
Problem
Existing semiconductor packages rely on expensive and unreliable non-volatile elements like fuses or anti-fuses to store die-specific parameters, which are not efficiently optimized for process variations.
Innovation Solution
Implementing a machine-readable pattern on the semiconductor package surface to encode die-specific information, such as operation parameters, using dots and spaces that can be read by a pattern reader to optimize die performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If non-volatile elements like fuses or anti-fuses are used to store die-specific parameters, then the parameters can be stored in the die itself, but the cost increases and reliability decreases
Solution Approach 1:
The patent creates an optical copy of die-specific information by projecting a pattern of light dots through the transparent package substrate to encode parameter data. This optical copying method replaces expensive and unreliable physical storage elements (fuses/anti-fuses) with a light-based information carrier that can be read without physical contact, thereby improving reliability while reducing manufacturing cost.
Solution Approach 2:
The patent substitutes the mechanical/electrical storage system (fuses and anti-fuses that require physical modification and electrical reading) with an optical system using light projection and detection. This replacement eliminates the need for complex electrical connections and physical storage elements, reducing both cost and improving reliability of parameter storage and retrieval.
2Ease of manufacture
If non-volatile elements like fuses or anti-fuses are used to store die-specific parameters, then the parameters can be stored in the die itself, but the method becomes expensive and unreliable
Solution Approach 1:
The patent creates an optical copy of die-specific information by projecting a pattern of light dots through the transparent package substrate to encode parameter data. This optical copying method replaces expensive and unreliable physical storage elements (fuses/anti-fuses) with a light-based information carrier that can be read without physical contact, thereby improving reliability while reducing manufacturing cost.
Solution Approach 2:
The patent substitutes the mechanical/electrical storage system (fuses and anti-fuses that require physical modification and electrical reading) with an optical system using light projection and detection. This replacement eliminates the need for complex electrical connections and physical storage elements, reducing both cost and improving reliability of parameter storage and retrieval.
3Adaptability or versatility
If traditional storage methods are used, then die-specific parameters can be stored, but the functionality and customization are limited
Solution Approach 1:
The patent implements a universal optical reading interface that can retrieve die-specific parameters from any package type through the transparent substrate. The system uses a standardized light projection and detection mechanism that works across different package configurations, enabling one reading device to handle multiple package types and parameter formats, thereby increasing adaptability without proportionally increasing device complexity.
Solution Approach 2:
The patent enables dynamic parameter retrieval and customization by using variable light patterns to encode different parameter sets. The optical system can project different dot patterns representing different parameter combinations, allowing the same physical package to provide customized operational parameters based on what is encoded in the light pattern, significantly enhancing functionality and adaptability.
Data Source
AI summary
Semiconductor device packages and associated methods are disclosed herein. In some embodiments, the semiconductor device package includes (1) a first surface and a second surface opposite the first surface; (2) a semiconductor die positioned between the first and second surfaces; and (3) a pattern positioned in a designated area of the first surface. The pattern includes multiple bit areas. Each of the bit areas represents a first bit information or a second bit information. the pattern presents information for operating the semiconductor die. The pattern is configured to be read by a pattern scanner.