Packaged Electronic Module for Smart Cards Using Segmented Assembly
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Solution Overview
Problem
Current methods for manufacturing smart cards with embedded electronics are costly, prone to component damage, and require specialized equipment, limiting their accessibility to all card manufacturers and increasing the unit cost of packaging chips.
Innovation Solution
A packaged electronic module that assembles all required electronics components, including an integrated circuit chip and contact plate, into a single module, which can be embedded into a plastic card using regular milling techniques, eliminating the need for flexible plastic substrates and lamination steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lamination and pressing operations are used to embed electronics into smart cards, then the electronics can be embedded into the card, but the components are prone to damage and additional capital expenditure is required for special equipment
Solution Approach 1:
The invention divides the manufacturing process into two independent stages: (1) assembling the electronic module on a separate carrier board with all electronic components, and (2) embedding the completed module into the smart card. This segmentation eliminates the need for complex lamination equipment during the embedding stage, as the module is already assembled and protected on its carrier board.
Solution Approach 2:
The electronic module is pre-assembled on the carrier board with all components (IC chips, contacts, antennas) before being embedded into the smart card. This preliminary assembly allows the module to be manufactured and tested independently, protecting components from damage during the embedding process and eliminating the need for specialized lamination equipment at the card manufacturer stage.
2Ease of manufacture
If flexible plastic substrates and lamination steps are used to mount electronics, then electronics can be mounted onto the card, but the unit cost of packaging chips increases
Solution Approach 1:
The invention merges multiple electronic components (IC chips, contacts, antennas, and other electronics) onto a single carrier board to form an integrated electronic module. This consolidation eliminates the need for separate flexible plastic substrates for each component and reduces material costs while maintaining ease of manufacture through standardized module assembly.
Solution Approach 2:
The carrier board serves multiple functions: it provides a mounting platform for all electronic components, acts as a structural support, enables electrical connections between components, and facilitates the embedding process into the smart card. This multi-functionality eliminates the need for additional flexible plastic substrates and reduces overall material requirements.
3Reliability
If specialized lamination equipment is used to embed electronics, then electronics can be embedded into cards, but additional capital expenditure is required
Solution Approach 1:
The invention separates the electronics assembly process from the card embedding process. The electronic module is assembled on a carrier board independently, then embedded into the smart card using simple mechanical insertion or adhesive bonding. This segmentation eliminates the need for specialized lamination equipment, as the module is already assembled and protected on its carrier board.
Solution Approach 2:
The carrier board acts as a temporary but essential platform for assembling and protecting the electronic module during manufacturing and embedding. After the module is embedded into the smart card, the carrier board can be removed or left as part of the final structure. This disposable carrier approach eliminates the need for expensive reusable lamination equipment while ensuring reliable component embedding.
Data Source
AI summary
The present invention is a packaged electronic module with embedded electronics for use in smart cards. This invention assembles a plurality of electronics components on a flexible printed circuit, together with an integrated circuit chip and a contact plate, into a module. This module can then be embedded into a plastic card, using regular milling techniques, by a card manufacturer. This method packages the plurality of electronics components into a module. The present invention provides a business with the capability to avoid additional capital expenditure required for special equipment and enables all existing card manufacturers to manufacture smart cards with embedded electronics.