Packaging Adhesive Thermal Expansion for OLED Sealing
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Solution Overview
Problem
The existing OLED display packaging process using frit faces challenges in controlling the height difference within 1 μm due to difficulties in coating and baking technologies, leading to poor packaging due to uneven frit heights, resulting in gaps between the packaging cover plate and the array substrate.
Innovation Solution
A packaging adhesive comprising borosilicate glass and quartz with a thermal expansion coefficient greater than the frit, applied in multiple layers with varying thermal expansion coefficients to enhance the expansion volume when heated, reducing gaps and improving packaging effectiveness through laser irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If glass powder is deposited by silk screen printing and prebaked to form frit, then the packaging adhesive can be applied to seal the edges, but the height difference of the formed frit cannot be controlled within 1 μm due to coating and baking technology limitations
Solution Approach 1:
The patent modifies the chemical composition parameters of the glass powder by adding specific metal oxides (Bi2O3, ZnO, B2O3) to change the melting characteristics and thermal expansion properties. This allows the frit to self-level and compensate for height variations during laser heating, achieving uniform sealing without requiring ultra-precise coating control
Solution Approach 2:
The patent utilizes thermal expansion differences by incorporating materials with specific thermal expansion coefficients into the glass powder formulation. During laser heating, the controlled thermal expansion enables the frit to flow and fill gaps, automatically compensating for initial height variations and achieving uniform sealing height
2Reliability
If the frit height varies significantly, then some regions achieve good packaging contact, but gaps form between the packaging cover plate and array substrate in low regions
Solution Approach 1:
The patent introduces a specially formulated glass powder composition as an intermediary material that can adapt to height variations. The modified glass powder acts as a buffer that flows during laser heating to fill gaps in low regions while maintaining appropriate contact pressure in high regions, ensuring uniform sealing quality across the entire packaging area
Solution Approach 2:
The patent transforms the static frit structure into a dynamic system by using laser heating to induce controlled melting and flow of the glass powder. This dynamic behavior allows the packaging adhesive to automatically adjust and redistribute, filling gaps and compensating for height variations to achieve uniform sealing
3Volume of stationary object
If conventional glass powder is used, then the packaging process can be completed, but the expansion volume during heating is insufficient to ensure good contact in all regions
Solution Approach 1:
The patent changes the compositional parameters of the glass powder by adding metal oxides that increase the coefficient of thermal expansion. This parameter modification enables the packaging adhesive to expand more vigorously during laser heating, ensuring sufficient contact pressure and filling capability across all regions of the packaging area
Solution Approach 2:
The patent directly applies thermal expansion principles by formulating glass powder with enhanced expansion characteristics. During laser heating, the increased thermal expansion generates greater volume increase in the packaging adhesive, ensuring it can flow into and fill all gaps between the packaging cover plate and array substrate, achieving reliable sealing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced thermal expansion coefficient of the packaging adhesive increases the expansion volume, ensuring better contact and sealing performance between the packaging cover plate and the array substrate, thereby improving packaging effectiveness and reducing air pores.
Implementation Method 1
a material with a thermal expansion coefficient larger than that of the frit... the thermal expansion coefficient of the packaging adhesive from which the organic solvent is removed may be enhanced
Implementation Method 2
the frit is heated by using laser irradiation to be smelted... irradiating the packaging layer using laser to form a sealing structure
Data Source
AI summary
The present disclosure provides a packaging adhesive, a packaging method, a display panel, and a display device. The packaging adhesive includes a frit, an organic solvent, and a material with a thermal expansion coefficient larger than that of the frit. Using the packaging adhesive provided by the present disclosure, the thermal expansion coefficient of the packaging adhesive from which the organic solvent is removed may be enhanced by doping the material with a thermal expansion coefficient larger than that of the frit into existing glass cement, so that in a packaging process using laser radiation, an expansion volume of the packaging adhesive when heated is increased. In this way, a gap between the packaging adhesive and an array substrate is effectively reduced, and a packaging effect is improved.