Packaging Structure With Protruding Resin Alignment

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Solution Overview

Problem

Existing packaging structures face challenges with high costs and reliability issues due to the need for expensive alignment devices and potential resin insertion between copper terminals during direct bonding, which can lower connection reliability.

Innovation Solution

A packaging structure that directly bonds metal terminals without using an alignment device in a vacuum chamber, utilizing protruding resin portions without fillers for alignment and bonding, and a sealing portion with fillers for enhanced strength, allowing for thermal compression bonding and curing to achieve high connection reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If an alignment device in a vacuum chamber is used for Cu-Cu direct bonding, then alignment precision is improved, but device cost and complexity increase

Engineering Contradiction:
Improvealignment precisionVSAvoidapparatus complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent divides the bonding process into two independent stages: (1) alignment stage using protruding resin portions without fillers, and (2) bonding stage using the aligned copper terminals. This segmentation allows each stage to use optimized methods without requiring a complex integrated vacuum alignment system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The protruding resin portions are formed in advance on the substrates before bonding. These pre-formed resin portions serve as alignment features that guide the substrates into correct positions during assembly, eliminating the need for expensive real-time alignment devices during the bonding process.

Inventive Principle:
Principle #10Preliminary action

2Ease of operation

If semi-cured resin is used for temporary fixing during hybrid bonding, then ease of operation is improved, but connection reliability deteriorates due to resin insertion between copper terminals

Engineering Contradiction:
Improvetemporary fixing easeVSAvoidconnection reliability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent extracts the alignment function from the bonding resin by using separate protruding resin portions made without fillers. This allows the bonding resin (which includes fillers for strength) to be applied only after alignment is achieved, preventing resin insertion between copper terminals while maintaining ease of operation.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent applies different resin compositions to different locations and functions: protruding resin portions without fillers for alignment (smooth surface for precise positioning), and bonding resin with fillers for structural strength. This local differentiation resolves the contradiction between ease of operation and connection reliability.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach eliminates the need for expensive alignment devices and reduces resin insertion errors, ensuring high connection reliability and cost-effectiveness in bonding metal terminals.

Implementation Method 1

the first protruding resin portion and the second protruding resin portion being directly bonded with each other

Methodology Applied
Scientific EffectThermal compression bonding:

Implementation Method 2

a front end side of the copper terminal and a surface of the resin are grinded or polished so that the heights of the copper terminal and the resin become equal

Methodology Applied
Scientific EffectGrinding: Abrasion

Implementation Method 3

the semi-cured resins are completely cured

Methodology Applied
Scientific EffectCuring:

Data Source

PatentUS9824993B2Packaging structure
Publication Date: 2017.11.21 SHINKO ELECTRIC IND CO LTD
  • US9824993B2 patent drawing
  • US9824993B2 patent drawing
  • US9824993B2 patent drawing

AI summary

A packaging structure includes a first substrate including a first metal terminal and a first protruding resin portion formed at a first surface; a second substrate including a second metal terminal and a second protruding resin portion formed at a second surface, the second metal terminal being made of the same kind of metal as the first metal terminal; and a sealing portion filled between the first surface of the first substrate and the second surface of the second substrate, the first metal terminal and the second metal terminal being directly bonded with each other, the first protruding resin portion and the second protruding resin portion being directly bonded with each other, each of the first protruding resin portion and the second protruding resin portion being made of a resin material that does not include fillers, and the sealing portion being made of a resin material including fillers.